Abstract: Apparatus for cutting and removing layers of photoresist overlaying tooling holes in a printed wire board blank. A lower cutter is mounted on a base so that its cutting edge projects above the upper surface of the base a distance substantially equal to the thickness of a layer of photoresist. A cutter head is mounted on the base for movement parallel to the upper surface of the base. An upper cutter is mounted on the cutter head for movement by a cutter actuator to cause the upper and lower cutters to sever segments of layers of photoresist overlaying a tooling hole of a PWB blank positioned between them. Each cutter is provided with a plunger movable within their respective cutters. The upper surface of the lower plunger, when the lower plunger is retracted, projects above the lower cutting edge of the lower cutter; and the upper plunger is biased downwardly so that its bottom surface projects below the cutting edges of the upper cutter.