Patents by Inventor Conrad Max Cachia

Conrad Max Cachia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package substrate and methods for forming same, in particular for MEMS devices
    Patent number: 8633583
    Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: January 21, 2014
    Assignees: STMicroelectrics S.r.l., STMicroelectronics (Malta) Ltd.
    Inventors: Federico Giovanni Ziglioli, Giovanni Graziosi, Mark Andrew Shaw, Mario Francesco Cortese, Conrad Max Cachia
  • Semiconductor package substrate and methods for forming same, In particular for mems devices
    Publication number: 20080128891
    Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
    Type: Application
    Filed: July 16, 2007
    Publication date: June 5, 2008
    Inventors: Federico Giovanni Ziglioli, Giovanni Graziosi, Mark Andrew Shaw, Mario Francesco Cortese, Conrad Max Cachia