Abstract: A method of producing an optical element for a lithography apparatus, comprising the steps of: a) detecting a height profile of a surface of a crystal substrate of the optical element, and b) ascertaining, using the height profile detected, an installed orientation (?2, ?4, ?6) of the optical element in an optical system of the lithography apparatus in relation to a stress-induced birefringence on incidence of polarized radiation, where the installed orientation (?2, ?4, ?6) is an orientation in relation to a rotation of the optical element about a center axis of the optical element that runs through the surface.

Abstract: An optical component comprises a first layer system exhibiting a first wavelength-dependent reflectivity curve when electromagnetic radiation impinges thereon, and at least one second layer system exhibiting a second wavelength-dependent reflectivity curve when electromagnetic radiation impinges thereon. The first layer system and the second layer system are arranged on different optical surfaces. The wavelength dependencies of the first and the second reflectivity curve at least partially compensate one another so that the relative deviation from a desired reflectivity curve which is linear or constant with respect to the wavelength is no more than 5% within the specified wavelength range for a resultant summated reflectivity for the first layer system and the at least one second layer system. An optical system, such as a microlithography projection exposure apparatus, can include such an optical component.

Abstract: An optical system, in particular for microlithography, comprises a laser light source for generating a multiplicity of light pulses, and a control unit configured to control the laser light source in such a way that, for a light pulse sequence generated by the laser light source, the time period between respectively successive light pulses varies across the light pulse sequence. A method comprises operating the optical system.

Abstract: Methods and apparatuses for a deposition system are provided to deposit a thin coating layer on flat substrates, such as semiconductors or panels. In an embodiment, liquid supplied rollers accepting liquid media provide liquid chemicals to the substrates for coating the substrates. The liquid delivery system can control the flow and the pressure of the liquid to achieve optimum process condition with minimum excess waste. In another embodiment, rollers with non-uniform distribution of liquid media provide a non-uniform thickness profile on the substrates, which can be used to compensate for the non-uniformity of subsequent processes.

Abstract: Methods and apparatuses for a deposition system are provided to deposit a thin coating layer on flat substrates, such as semiconductors or panels. In an embodiment, liquid supplied rollers accepting liquid media provide liquid chemicals to the substrates for coating the substrates. The liquid delivery system can control the flow and the pressure of the liquid to achieve optimum process condition with minimum excess waste. In another embodiment, rollers with non-uniform distribution of liquid media provide a non-uniform thickness profile on the substrates, which can be used to compensate for the non-uniformity of subsequent processes.

Abstract: Methods and apparatuses for a deposition system are provided to deposit a thin coating layer on flat substrates, such as semiconductors or panels. In an embodiment, liquid supplied rollers accepting liquid media provide liquid chemicals to the substrates for coating the substrates. The liquid delivery system can control the flow and the pressure of the liquid to achieve optimum process condition with minimum excess waste. In another embodiment, rollers with non-uniform distribution of liquid media provide a non-uniform thickness profile on the substrates, which can be used to compensate for the non-uniformity of subsequent processes.

Abstract: Methods and apparatuses for a deposition system are provided to deposit a thin coating layer on flat substrates, such as semiconductors or panels. In an embodiment, liquid supplied rollers accepting liquid media provide liquid chemicals to the substrates for coating the substrates. The liquid delivery system can control the flow and the pressure of the liquid to achieve optimum process condition with minimum excess waste. In another embodiment, rollers with non-uniform distribution of liquid media provide a non-uniform thickness profile on the substrates, which can be used to compensate for the non-uniformity of subsequent processes.

Abstract: Methods and apparatuses for a deposition system are provided to deposit a thin coating layer on flat substrates, such as semiconductors or panels. In an embodiment, liquid supplied rollers accepting liquid media provide liquid chemicals to the substrates for coating the substrates. The liquid delivery system can control the flow and the pressure of the liquid to achieve optimum process condition with minimum excess waste. In another embodiment, rollers with non-uniform distribution of liquid media provide a non-uniform thickness profile on the substrates, which can be used to compensate for the non-uniformity of subsequent processes.

Abstract: Methods and apparatuses for a deposition system are provided to deposit a thin coating layer on flat substrates, such as semiconductors or panels. In an embodiment, liquid supplied rollers accepting liquid media provide liquid chemicals to the substrates for coating the substrates. The liquid delivery system can control the flow and the pressure of the liquid to achieve optimum process condition with minimum excess waste. In another embodiment, rollers with non-uniform distribution of liquid media provide a non-uniform thickness profile on the substrates, which can be used to compensate for the non-uniformity of subsequent processes.