Abstract: The present invention relates to a process for treating keratin materials, especially human keratin fibers, comprising the application of a composition comprising i) at least one flavin derivative and ii) at least one polymerizable molecule, preferably a photopolymerizable molecule, and at least one step of exposing said materials to artificial or natural light radiation, in particular for caring for and/or repairing the keratin materials.

Abstract: A process for obtaining a material includes a substrate coated with a photocatalytic coating, the process including depositing on the substrate, by sputtering, a stack of thin layers successively including a first layer of titanium metal having a thickness of from 1 to 3 nm, an intermediate layer of at least partially oxidized titanium having a thickness of from 0.5 to 5 nm, and a second layer of titanium metal having a thickness of from 2 to 5 nm; and oxidizing the stack, with the aid of a heat treatment by laser radiation, wherein the stack is in contact with an oxidizing atmosphere.

Abstract: A solar protection and/or thermal insulation glazing including a substrate, in particular a glass substrate, provided with a stack of thin layers which act on solar radiation, the stack having the succession of the following layers, starting from the surface of the glass: an underlayer or a set of underlayers, the underlayer(s) having dielectric materials, a layer based on titanium oxide also having silicon, the overall Si/Ti atomic ratio in said layer being between 0.01 and 0.25, and in which Si and Ti represent at least 90% of the atoms other than oxygen, the thickness of the layer being between 20 and 70 nm, an overlayer or a set of overlayers, said overlayer(s) having dielectric materials.

Abstract: A solar protection and/or thermal insulation glazing including a substrate, in particular a glass substrate, provided with a stack of thin layers which act on solar radiation, the stack having the succession of the following layers, starting from the surface of the glass: an underlayer or a set of underlayers, the underlayer(s) having dielectric materials, a layer based on titanium oxide also having silicon, the overall Si/Ti atomic ratio in said layer being between 0.01 and 0.25, and in which Si and Ti represent at least 90% of the atoms other than oxygen, the thickness of the layer being between 20 and 70 nm, an overlayer or a set of overlayers, said overlayer(s) having dielectric materials.

Abstract: A process for forming an array of irregularities or features that are submicron-size in height and that have a characteristic lateral dimension that is micron- or submicron-size, over a surface of a material by reactive-ion etching, the process including: supplying the material with a thickness at least equal to 100 nm, the material being a solid hybrid material that includes: a simple silicon oxide or a mixed silicon oxide, most of the oxides in the case of a mixed oxide being silicon oxide, an oxide molar percentage in the material being at least 40%; and a species, of a different nature to the silicon of the oxide, a molar percentage of the species in the material ranging from 1 mol % or even up to 50 mol % while remaining below the percentage of the silicon oxide, at least most of the species having a largest characteristic dimension smaller than 50 nm, optionally heating the hybrid material before the etching; structuring the surface of the hybrid material, without masking, with etching that lasts less t

Abstract: A process for forming an array of irregularities or features that are submicron-size in height and that have a characteristic lateral dimension that is micron- or submicron-size, over a surface of a material, by ion erosion, the process including: supplying the material with a thickness at least equal to 100 nm, the material being a solid hybrid material that includes: a simple oxide or a mixed oxide of one or more elements, an oxide molar percentage in the material being at least 40%; and a species, of a different nature to the one or more elements of the oxide, a molar percentage of the species in the material ranging from 6 mol % up to 50 mol % while remaining below the percentage of the oxide, most of the species having a largest characteristic dimension smaller than 50 nm, optionally heating the hybrid material before the erosion; structuring the surface of the hybrid material with an erosion that lasts less than one hour over an erosion area greater than 1 cm2, until the array of features is formed, the

Abstract: A process for forming an array of irregularities or features that are submicron-size in height and that have a characteristic lateral dimension that is micron- or submicron-size, over a surface of a material, by ion erosion, the process including: supplying the material with a thickness at least equal to 100 nm, the material being a solid hybrid material that includes: a simple oxide or a mixed oxide of one or more elements, an oxide molar percentage in the material being at least 40%; and a species, of a different nature to the one or more elements of the oxide, a molar percentage of the species in the material ranging from 6 mol % up to 50 mol % while remaining below the percentage of the oxide, most of the species having a largest characteristic dimension smaller than 50 nm, optionally heating the hybrid material before the erosion; structuring the surface of the hybrid material with an erosion that lasts less than one hour over an erosion area greater than 1 cm2, until the array of features is formed, the

Abstract: A process for forming an array of irregularities or features that are submicron-size in height and that have a characteristic lateral dimension that is micron- or submicron-size, over a surface of a material by reactive-ion etching, the process including: supplying the material with a thickness at least equal to 100 nm, the material being a solid hybrid material that includes: a simple silicon oxide or a mixed silicon oxide, most of the oxides in the case of a mixed oxide being silicon oxide, an oxide molar percentage in the material being at least 40%; and a species, of a different nature to the silicon of the oxide, a molar percentage of the species in the material ranging from 1 mol % or even up to 50 mol % while remaining below the percentage of the silicon oxide, at least most of the species having a largest characteristic dimension smaller than 50 nm, optionally heating the hybrid material before the etching; structuring the surface of the hybrid material, without masking, with etching that lasts less t