Patents by Inventor Constantin HETZER

Constantin HETZER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230042041
    Abstract: The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.
    Type: Application
    Filed: December 18, 2020
    Publication date: February 9, 2023
    Inventors: Karlheinz ARNDT, Matthias GOLDBACH, Simon JEREBIC, Matthias HOFMANN, Markus BOSS, Constantin HETZER, Harald JAEGER, Jens EBERHARD, Sebastian STOLL