Abstract: By employing High Density Interconnect (HDI) multi-chip modules (MCMs) having elements of a distributed power supply embedded in the MCM itself, the functions of an MCM and a power converter are combined. The embedded power supply elements include DC-DC or AC-DC converters to convert an input voltage and input current to a relatively lower output voltage and relatively higher output current, thereby decreasing the current requirements of external power supply lines connected to the multi-chip module. The current and voltage outputs may be connected to chip power inputs through relatively short, low-impedance power distribution conductors comprising copper strips direct bonded to a ceramic substrate; alternatively, or in combination with direct bonded copper conductors, the low-impedance power distribution conductors may be situated within an HDI overcoat structure. The power supply elements may be placed within cavities formed in the substrate, or on a thinner portion of the substrate.

Abstract: A hermetically sealed electronic package particularly adapted for high density interconnect (HDI) electronic systems, employs a ceramic substrate as the package base. The substrate is provided with module contact pads. A barrier support frame on the module contact pads divides them into inner and outer portions. A plurality of electronic components, such as integrated circuit chips, are fastened to the substrate within the perimeter of the barrier support frame, and interconnections are provided between inner portions of the module contact pads and contact pads on the electronic components. A polymer barrier layer is deposited over the area enclosed by the barrier support frame as well as a portion of the frame itself, and is overlaid with a metal barrier layer. A protective solder layer is deposited on the metal barrier layer to bridge any voids in the metal barrier layer.