Patents by Inventor Cooper Levy

Cooper Levy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260186369
    Abstract: Some embodiments include apparatuses including a driver with a baseline wander compensation and photocurrent sensing. The driver includes output nodes to couple to terminals of a photonic micro-ring modulator through a first circuit path and a second circuit path. The first circuit path and the second circuit path include unequal numbers of circuit elements.
    Type: Application
    Filed: December 27, 2024
    Publication date: July 2, 2026
    Inventors: Wonho Lee, Ganesh Balamurugan, Cooper Levy
  • Patent number: 12631838
    Abstract: A rotatable circular waveguide structure is described that may comprise circular waveguide sections configured to propagate electromagnetic radiation. The circular waveguide sections may enable data signals to be transmitted between portions of an electronic device, such as a chassis and display portion, which may be rotatable with respect to one another. The rotatable circular waveguide structure may comprise one or more circular waveguide sections that are routed through a hinge of the electronic device, as well as one or more rotatable junctions. The rotatable junctions enable a rotation of circular waveguide sections with respect to one another as the coupled portions of the electronic device are also rotated. The rotatable circular waveguide structure may replace the use of data cables that are conventionally used to carry data signals between portions of an electronic device.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: May 19, 2026
    Assignee: Intel Corporation
    Inventors: Debabani Choudhury, Huimin Chen, Eric Gantner, Stephen Hall, Cooper Levy, Shawn Mceuen, Luis Paniagua Acuna, Peter Sagazio, Harry Skinner, Kerry Stevens, Ana Yepes
  • Publication number: 20260003214
    Abstract: Embodiments herein relate to a driver circuit for an optical modulator such as a micro-ring modulator (MRM). The driver circuit includes first and second drivers which receive respective differential data signals, and which have their output nodes coupled to a cathode and anode, respectively of the MRM. One or both of the drivers can have their output nodes alternating-current (AC)-coupled to a bias circuit which biases the voltage of the output signal to shift its voltage swing. The bias circuit can include a latch which receives Vbc_high at its power supply terminal and Vbc_low at its ground terminal, where Vbc_high>Vbc_low>0 V.
    Type: Application
    Filed: June 28, 2024
    Publication date: January 1, 2026
    Inventors: Cooper Levy, Jahnavi Sharma, Ganesh Balamurugan
  • Publication number: 20250172967
    Abstract: Hinged computing devices having intra-device wireless communications are disclosed. A disclosed example apparatus for use with a foldable computing device includes a hinge by which first and second folding portions of the computing device are rotatably coupled, a first antenna of the first folding portion, a second antenna of the second folding portion, the first and second antennas to be wirelessly communicatively coupled to one another, the first and second antennas separate from the hinge, and equalizer circuitry to enable equalization between the first and second antennas to maintain signals therebetween to meet a bit error rate (BER) threshold over a range of motion of the first folding portion relative to the second folding portion.
    Type: Application
    Filed: April 2, 2022
    Publication date: May 29, 2025
    Applicant: Intel Corporation
    Inventors: Jo-han YU, Chintan THAKKAR, Debabani CHOUDHURY, Sidharth DALMIA, Cooper LEVY, Eric GANTNER, Ana YEPES, Huimin CHEN, Luis Carlos PANIAGUA ACUNA, Stephen HALL
  • Publication number: 20250004222
    Abstract: A rotatable circular waveguide structure is described that may comprise circular waveguide sections configured to propagate electromagnetic radiation. The circular waveguide sections may enable data signals to be transmitted between portions of an electronic device, such as a chassis and display portion, which may be rotatable with respect to one another. The rotatable circular waveguide structure may comprise one or more circular waveguide sections that are routed through a hinge of the electronic device, as well as one or more rotatable junctions. The rotatable junctions enable a rotation of circular waveguide sections with respect to one another as the coupled portions of the electronic device are also rotated. The rotatable circular waveguide structure may replace the use of data cables that are conventionally used to carry data signals between portions of an electronic device.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 2, 2025
    Inventors: Debabani Choudhury, Huimin Chen, Eric Gantner, Stephen Hall, Cooper Levy, Shawn Mceuen, Luis Paniagua Acuna, Peter Sagazio, Harry Skinner, Kerry Stevens, Ana Yepes
  • Patent number: 11056517
    Abstract: Methods and devices that monolithically integrate thin film elements/devices, e.g., environmental sensors, batteries and biosensors, with high performance integrated circuits, i.e., integrated circuits formed in a high quality device layer. Preferred embodiments further monolithically integrate a solar cell array. Preferred embodiments provide pin-size and integrated solar powered wearable electronic, ionic, molecular, radiation, etc. sensors and circuits.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: July 6, 2021
    Assignee: The Regents of the University of California
    Inventors: Shadi A. Dayeh, Yun Goo Ro, Namseok Park, Atsunori Tanaka, Siarhei Vishniakou, Ahmed Youssef, James Buckwalter, Cooper Levy
  • Publication number: 20180040649
    Abstract: Methods and devices that monolithically integrate thin film elements/devices, e.g., environmental sensors, batteries and biosensors, with high performance integrated circuits, i.e., integrated circuits formed in a high quality device layer. Preferred embodiments further monolithically integrate a solar cell array. Preferred embodiments provide pin-size and integrated solar powered wearable electronic, ionic, molecular, radiation, etc. sensors and circuits.
    Type: Application
    Filed: March 10, 2016
    Publication date: February 8, 2018
    Inventors: Shadi A. Dayeh, Yun Goo Ro, Namseok Park, Atsunori Tanaka, Siarhei Vishniakou, Ahmed Youssef, James Buckwalter, Cooper Levy