Patents by Inventor CoorsTek, Inc.

CoorsTek, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130168905
    Abstract: A reaction bonded ceramic body that has 50% to 60%, by weight, boron carbide, and 20% to 30%, by weight, silicon carbide. The reaction bonded ceramic body has least a portion of the boron carbide reacted with silicon to become siliconized boron carbide. Also, a method of making a reaction bonded ceramic material. The method may include the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder, and contacting the green body with a liquid infiltrant comprising silicon. The infiltrant has a temperature of about 1625° C. to about 1700° C. Furthermore, a method of making a reaction bonded boron carbide ceramic body. The method includes the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder. The weight ratio of boron carbide to carbon in the green body may be about 5:5 to 1 or more.
    Type: Application
    Filed: January 28, 2013
    Publication date: July 4, 2013
    Applicant: CoorsTek, Inc.
    Inventor: CoorsTek, Inc.
  • Publication number: 20130115418
    Abstract: Embodiments relate to a coated substrate and a method of making and using the same. A plasma-spray coated layer may be formed on a substrate, wherein the plasma-sprayed coated layer comprises a rare-earth oxide (e.g., yttrium oxide), a rare-earth fluoride (e.g. yttrium fluoride), or a rare-earth silicate (e.g. yttrium silicate). An exposed surface of the plasma-spray coated layer may be irradiated to form a treated portion of the layer, wherein the treated portion of the layer has a mean spacing of local peaks (S value) between about 100 and 200 microns. A second layer may be formed on the treated portion of the plasma-spray coated layer, wherein the second layer comprises a dielectric material.
    Type: Application
    Filed: October 19, 2012
    Publication date: May 9, 2013
    Applicant: CoorsTek, Inc.
    Inventor: CoorsTek, Inc.