Patents by Inventor Copperleaf Technologies Inc.

Copperleaf Technologies Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130179212
    Abstract: Automated systems and methods for use in managing collections of capital assets determine optimal replacement dates for assets based on total cost curves. Replacement dates are adjusted within ranges that avoid unacceptable risk of unmonetizable failures to satisfy constraints. Priority in adjusting replacement dates is determined based on deferral cost metrics which may be based on the total cost curves.
    Type: Application
    Filed: December 10, 2012
    Publication date: July 11, 2013
    Applicant: COPPERLEAF TECHNOLOGIES INC.
    Inventor: Copperleaf Technologies Inc.
  • Publication number: 20130179213
    Abstract: Automated systems and methods for use in managing collections of capital assets determine optimal replacement dates for assets based on total cost curves. Replacement dates are adjusted within ranges that avoid unacceptable risk of unmonetizable failures to satisfy constraints. Priority in adjusting replacement dates is determined based on deferral cost metrics which may be based on the total cost curves.
    Type: Application
    Filed: December 10, 2012
    Publication date: July 11, 2013
    Applicant: Copperleaf Technologies Inc.
    Inventor: Copperleaf Technologies Inc.
  • Publication number: 20130173325
    Abstract: Automated systems and methods for use in managing collections of capital assets determine optimal replacement dates for assets based on total cost curves. Replacement dates are adjusted within ranges that avoid unacceptable risk of unmonetizable failures to satisfy constraints. Priority in adjusting replacement dates is determined based on deferral cost metrics which may be based on the total cost curves.
    Type: Application
    Filed: December 10, 2012
    Publication date: July 4, 2013
    Applicant: COPPERLEAF TECHNOLOGIES INC.
    Inventor: Copperleaf Technologies Inc.