Abstract: A probe card for testing integrated circuit devices. The probe card includes a first circuit having a plurality of traces disposed thereon. The probe card also includes a plurality of pins to couple to a device under test. An interface element interfaces a first set of pins of the plurality of pins with the plurality of traces on the first circuit. The interface element includes a conductive plane coupled to a second set of pins of the plurality of pins to provide power and ground to the device under test.

Abstract: A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a conductive plane to interface a second set of pins of the probe head with the first circuit. The conductive plane is further coupled to provide at least one of power or ground to the second set of pins.

Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. A deformable conductor is electrically coupled between the first contact element and the second contact element. The deformable conductor maintains the electrical coupling between the first contact element and the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.