Abstract: A method of assessing a membrane, including calculating fluid dynamic characteristics of at least one of a membrane and a material to be passed through the membrane, where the material comprises particles; obtaining characteristic of at least one force acting on the particles of the material to be passed through the membrane due to the interaction between the particles and the membrane, the at least one force being an intermolecular force; combining the calculated fluid dynamic characteristic and the obtained characteristics to assess the flow of the material through the membrane; and optimizing at least one characteristics of the membrane in relation to the material. The membrane includes a plurality of rows and a plurality of teardrop structures arranged in the plurality of rows. The teardrop structures in each row are arranged at substantially the same angle with respect to an anticipated direction of flow through the membrane.

Abstract: A method of assessing a membrane, including calculating fluid dynamic characteristics of at least one of a membrane and a material to be passed through the membrane, where the material comprises particles; obtaining characteristic of at least one force acting on the particles of the material to be passed through the membrane due to the interaction between the particles and the membrane, the at least one force being an intermolecular force; combining the calculated fluid dynamic characteristic and the obtained characteristics to assess the flow of the material through the membrane; and optimizing at least one characteristics of the membrane in relation to the material. The membrane includes a plurality of rows and a plurality of teardrop structures arranged in the plurality of rows. The teardrop structures in each row are arranged at substantially the same angle with respect to an anticipated direction of flow through the membrane.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.