Patents by Inventor Corey Ciullo

Corey Ciullo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
    Patent number: 10988852
    Abstract: Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: April 27, 2021
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Mark Scalisi, Corey Ciullo
  • METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH
    Publication number: 20170114469
    Abstract: Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Application
    Filed: October 27, 2015
    Publication date: April 27, 2017
    Inventors: Matthew Thorseth, Mark Scalisi, Corey Ciullo