Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, the quantity of hardware resources available may be modified. The quantity of hardware resources may be modified by adding removable cards. When the removable card is added, a retention element may be used to secure the removable card in place. The retention element may be adaptable to allow for removable cards of varying topology to be secured. The retention element may secure the removable cards automatically or in response to user intervention.

Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, the quantity of hardware resources available may be modified. The quantity of hardware resources may be modified by adding removable cards. When the removable card is added, a retention element may be used to secure the removable card in place. The retention element may be adaptable to allow for removable cards of varying topology to be secured. The retention element may secure the removable cards automatically or in response to user intervention.

Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.

Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.

Abstract: An active device module may include an active device, a housing configured to house the active device, and heat-rejecting media thermally coupled to the active device and mechanically coupled to the housing such that when the active device module is coupled to an input/output interface of an information handling system, at least a portion of the heat-rejecting media resides external to a chassis enclosing components of the information handling system such that physical shape and size of the heat-rejecting media is not constrained by the chassis.

Abstract: An active device module may include an active device, a housing configured to house the active device, and heat-rejecting media thermally coupled to the active device and mechanically coupled to the housing such that when the active device module is coupled to an input/output interface of an information handling system, at least a portion of the heat-rejecting media resides external to a chassis enclosing components of the information handling system such that physical shape and size of the heat-rejecting media is not constrained by the chassis.

Abstract: A split chassis system includes a first chassis base portion that is configured to house a first component and a second chassis base portion that is configured to house a second component. The second chassis base portion is positioned adjacent the first chassis base portion such that a first chassis coupling member included on the first chassis base portion is coupled to a second chassis coupling member included on the second chassis base portion. The split chassis system further includes a leveling subsystem that is coupled to the first chassis base portion and the second chassis base portion. The leveling subsystem aligns the first chassis base portion and the second chassis base portion such that the first chassis base portion and the second chassis base portion substantially maintain coplanarity when the first chassis coupling member is coupled to the second chassis coupling member.

Abstract: A method and an information handling system provide flexible interconnections between two endpoints and in particular to allow for the allocation and reallocation of PCI lanes. A flexible interconnect media system is capable of connecting a CPU to an I/O device. The flexible interconnect media system includes I/O slots that are each capable of receiving an I/O device, connection interfaces each correlated with an I/O slot, link taps with correlated ports for each CPU, and flexible interconnect media capable of connecting an open connection interface with an open link tap, whereby a connection between the CPU and the I/O device is completed.

Abstract: A power supply system includes a chassis defining a bay. Power supply form factor element(s) are located on the chassis adjacent the bay. The power supply form factor element(s) may be used to guide a first form factor power supply through the bay and into engagement with a connector when the first form factor power supply is moved through a bay entrance, or guide a second form factor power supply through the bay and into engagement with a portion of the connector when the second form factor power supply is moved through a first section of the bay entrance. Furthermore, the power supply form factor element(s) prevent movement of the second form factor power supply through the bay and into engagement with the connector when the second form factor power supply attempts to move through a second section of the bay entrance that is different than the first section.

Abstract: Components installed on a topside of printed circuit board (PCB), such as a motherboard, are provided airflow cooling by a plurality of cooling fans located on a proximal end of the PCB. A hardware component is installed on the topside of a distal end of the PCB, furthest from the cooling fans. The hardware component includes cooling elements that extend to the underside of the PCB. Cooling the hardware component is complicated by the distance from the cooling fans and the cooling elements that extend below the PCB. A plenum extending from the proximal end of the PCB towards the distal end of the PCB is installed on the underside of the PCB. The plenum draws airflow from the cooling fans and delivers the airflow to the hardware component along the underside of the PCB, thus avoiding heating by the components on the topside of the PCB.

Abstract: A split chassis system includes a first chassis base portion that is configured to house a first component and a second chassis base portion that is configured to house a second component. The second chassis base portion is positioned adjacent the first chassis base portion such that a first chassis coupling member included on the first chassis base portion is coupled to a second chassis coupling member included on the second chassis base portion. The split chassis system further includes a leveling subsystem that is coupled to the first chassis base portion and the second chassis base portion. The leveling subsystem aligns the first chassis base portion and the second chassis base portion such that the first chassis base portion and the second chassis base portion substantially maintain coplanarity when the first chassis coupling member is coupled to the second chassis coupling member.

Abstract: A split chassis system includes a first chassis base portion that is configured to house a first component and a second chassis base portion that is configured to house a second component. The second chassis base portion is positioned adjacent the first chassis base portion such that a first chassis coupling member included on the first chassis base portion is coupled to a second chassis coupling member included on the second chassis base portion. The split chassis system further includes a leveling subsystem that is coupled to the first chassis base portion and the second chassis base portion. The leveling subsystem aligns the first chassis base portion and the second chassis base portion such that the first chassis base portion and the second chassis base portion substantially maintain coplanarity when the first chassis coupling member is coupled to the second chassis coupling member.

Abstract: A power supply system includes a chassis defining a bay. Power supply form factor element(s) are located on the chassis adjacent the bay. The power supply form factor element(s) may be used to guide a first form factor power supply through the bay and into engagement with a connector when the first form factor power supply is moved through a bay entrance, or guide a second form factor power supply through the bay and into engagement with a portion of the connector when the second form factor power supply is moved through a first section of the bay entrance. Furthermore, the power supply form factor element(s) prevent movement of the second form factor power supply through the bay and into engagement with the connector when the second form factor power supply attempts to move through a second section of the bay entrance that is different than the first section.

Abstract: A power supply system includes a chassis defining a bay. Power supply form factor element(s) are located on the chassis adjacent the bay. The power supply form factor element(s) may be used to guide a first form factor power supply through the bay and into engagement with a connector when the first form factor power supply is moved through a bay entrance, or guide a second form factor power supply through the bay and into engagement with a portion of the connector when the second form factor power supply is moved through a first section of the bay entrance. Furthermore, the power supply form factor element(s) prevent movement of the second form factor power supply through the bay and into engagement with the connector when the second form factor power supply attempts to move through a second section of the bay entrance that is different than the first section.

Abstract: A split chassis system includes a first chassis base portion that is configured to house a first component and a second chassis base portion that is configured to house a second component. The second chassis base portion is positioned adjacent the first chassis base portion such that a first chassis coupling member included on the first chassis base portion is coupled to a second chassis coupling member included on the second chassis base portion. The split chassis system further includes a leveling subsystem that is coupled to the first chassis base portion and the second chassis base portion. The leveling subsystem aligns the first chassis base portion and the second chassis base portion such that the first chassis base portion and the second chassis base portion substantially maintain coplanarity when the first chassis coupling member is coupled to the second chassis coupling member.

Abstract: A power supply system includes a chassis defining a bay. Power supply form factor element(s) are located on the chassis adjacent the bay. The power supply form factor element(s) may be used to guide a first form factor power supply through the bay and into engagement with a connector when the first form factor power supply is moved through a bay entrance, or guide a second form factor power supply through the bay and into engagement with a portion of the connector when the second form factor power supply is moved through a first section of the bay entrance. Furthermore, the power supply form factor element(s) prevent movement of the second form factor power supply through the bay and into engagement with the connector when the second form factor power supply attempts to move through a second section of the bay entrance that is different than the first section.

Abstract: An information handling system (IHS), peripheral component interface (PCI) system and method for expanding PCI nodes in an IHS. The PCI system includes a primary PCI node. The primary PCI node has a PCI switch communicatively coupled to a processor via a system interconnect. The PCI switch is communicatively coupled to several PCI devices. A communication module is communicatively coupled to the PCI switch. A PCI expansion node is communicatively coupled to the primary PCI node via a PCI bus and a sideband bus. The IHS executes firmware that enables expansion of the IHS by configuring the primary PCI node to recognize the one or more interconnected PCI expansion nodes and integrate the functions of the interconnected PCI expansion nodes into an expanded PCI subsystem. The primary PCI node and PCI expansion node can be substantially identical IHSs, having the same motherboards and chassis.

Abstract: In accordance with these and embodiments of the present disclosure, an information handling system may include a circuit board, an information handling resource electrically coupled to the circuit board, and a mechanical mechanism configured to receive a user interaction at a mechanical mechanism, and, in response to the user interaction, separate a mechanical bond between the information handling resource and a component by applying a controlled force of the mechanical mechanism to the information handling resource at a controlled location of the information handling resource.

Abstract: A board assembly includes a first board. The first board includes a first board connector that is configured to connect to a first baseboard connector receptacle included on a baseboard and a first board component coupled to the first board connector through the first board. The board assembly also includes a second board that is movably coupled to the first board by at least one floating coupling that allows the second board to move relative to the first board. The second board includes a second board connector that is configured to connect to a second baseboard connector receptacle included on the baseboard and a second board component coupled to the second board connector through the second board.