Patents by Inventor Corey Deyo

Corey Deyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluid ejection device
    Patent number: 9463485
    Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: October 11, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Corey Deyo, Ed Friesen
  • FLUID EJECTION DEVICE
    Publication number: 20150034734
    Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.
    Type: Application
    Filed: April 24, 2012
    Publication date: February 5, 2015
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Rio Rivas, Corey Deyo, Ed Friesen