Patents by Inventor Corey J. Risty

Corey J. Risty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230383911
    Abstract: In a system for dispensing a cryogenic fluid, a bulk tank is configured to contain a supply of a cryogenic liquid. A sump is configured to receive cryogenic liquid from the bulk tank. A first positive-displacement pump is positioned within the sump and is configured to be submerged within and pump cryogenic liquid stored within the sump. A second positive-displacement pump is positioned within the sump and is configured to be submerged within and pump cryogenic liquid stored within the sump. A vaporizing heat exchanger is configured to receive and vaporize cryogenic liquid pumped from the first pump and/or the second pump.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 30, 2023
    Inventors: Corey J. Risty, Thomas K. Drube, Ian Neeser, Joshua Steffen, Troy Lindquist
  • Patent number: 9373986
    Abstract: An electric motor assembly that eliminates external component-to-component assembly seams between coupled packaging hardware that would inhibit the creation and maintenance of, for example, IP 66 and IP 67 seals while utilizing inexpensive existing motor shaft rear bearing supports and also creating additional internal electronic packaging space. The disclosure provides an assembly with a continuous (e.g., no interruptions or seams) surface area to support IP sealing of the entire packaging-to-package interface between a primary motor frame (e.g., housing) and externally attached secondary/ancillary electronic hardware.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: June 21, 2016
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Edward F. Quade, Shawn Cloran, John S. Lindblom, Corey J. Risty
  • Patent number: 9048708
    Abstract: An electronics drive module is connected to the flange of a drive motor assembly. The module includes: a metal frame including a peripheral wall; and a metal floor. A power supply PCBA is located adjacent the upper surface of the metal floor, and a switching chip assembly is located adjacent the lower surface of the floor. The base plate of the switching chip assembly conducts heat into the floor and conducts heat into the mounting flange. An environmental seal is located between the lower edge of the frame and the sealing surface of the mounting flange and extending coextensively with the lower edge of the peripheral wall such that a sealing zone is defined within the peripheral wall of the frame and the first and second thermal interfaces are located within the sealing zone.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: June 2, 2015
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Shawn D. Cloran, Zoran Vrankovic, Corey J. Risty
  • Publication number: 20140125174
    Abstract: An electric motor assembly that eliminates external component-to-component assembly seams between coupled packaging hardware that would inhibit the creation and maintenance of, for example, IP 66 and IP 67 seals while utilizing inexpensive existing motor shaft rear bearing supports and also creating additional internal electronic packaging space. The disclosure provides an assembly with a continuous (e.g., no interruptions or seams) surface area to support IP sealing of the entire packaging-to-package interface between a primary motor frame (e.g., housing) and externally attached secondary/ancillary electronic hardware.
    Type: Application
    Filed: November 2, 2012
    Publication date: May 8, 2014
    Inventors: Edward F. Quade, Shawn Cloran, John S. Lindblom, Corey J. Risty
  • Publication number: 20140125161
    Abstract: An electronics drive module is connected to the flange of a drive motor assembly. The module includes: a metal frame including a peripheral wall; and a metal floor. A power supply PCBA is located adjacent the upper surface of the metal floor, and a switching chip assembly is located adjacent the lower surface of the floor. The base plate of the switching chip assembly conducts heat into the floor and conducts heat into the mounting flange. An environmental seal is located between the lower edge of the frame and the sealing surface of the mounting flange and extending coextensively with the lower edge of the peripheral wall such that a sealing zone is defined within the peripheral wall of the frame and the first and second thermal interfaces are located within the sealing zone.
    Type: Application
    Filed: November 5, 2012
    Publication date: May 8, 2014
    Applicant: Rockwell Automation Technologies, Inc.
    Inventors: Shawn D. Cloran, Zoran Vrankovic, Corey J. Risty