Patents by Inventor Corey M. Dayton

Corey M. Dayton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7519120
    Abstract: EMI emissions generated by clock signals in a multi-slot electronic system are reduced by providing out-of-phase clock signals to alternate slots, which cause EMI emissions at typical testing distances and farther to be reduced. An electronic equipment comprises a plurality of slots, each slot operable to receive a clock signal and a plurality of phases of the clock signal, wherein a first phase of the clock signal is routed to a portion of the slots and a second phase of the clock signal is routed to a different portion of the slots. The second phase of the clock signal may be substantially 180° out-of-phase with the first phase of the clock signal.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: April 14, 2009
    Assignee: Fujitsu Limited
    Inventors: Sheng Wu, Noah Gottfried, James Burnell, Corey M. Dayton
  • Patent number: 7111674
    Abstract: A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one or more heat generating components within the housing. A compliant thermally conductive material may then be placed between the heat generating components and the plate to facilitate conductive heat transfer from the component to the plate. From the plate, heat is transferred to the external environment through radiation and convection of air through perforations in the housing which cover a substantial portion of the surface area of the housing. The housing may also be inexpensively manufactured through stamping and may include two mating pieces which interlock using chamfered electrostatic discharge fingers. The housing may also incorporate a metal shroud for enveloping certain ESD sensitive connectors, such as optical couplers.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: September 26, 2006
    Assignee: Fujitsu Limited
    Inventors: Albert Pedoeem, Willie Ernst Braun, Lang Yuan, Corey M. Dayton, Steven M. Cherry