Patents by Inventor Corey Michael Buczek

Corey Michael Buczek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260109089
    Abstract: A transfer molding system includes a plurality of resin receptacles selectively movable by a resin support into registration with a first actuator for dispensing resin material through a transfer manifold and into a component core. Two or more component cores are supported on a core support for selective movement to a position for receiving resin material dispensed through the manifold. The resin receptacles and manifold may be controllably heated to melt the resin material and maintain temperatures to facilitate resin transfer into the component cores.
    Type: Application
    Filed: December 18, 2025
    Publication date: April 23, 2026
    Applicant: KUKA Systems North America LLC
    Inventors: Brian E. Connolly, Corey Michael Buczek
  • Patent number: 12564989
    Abstract: A transfer molding system includes a plurality of resin receptacles selectively movable by a resin support into registration with a first actuator for dispensing resin material through a transfer manifold and into a component core. Two or more component cores are supported on a core support for selective movement to a position for receiving resin material dispensed through the manifold. The resin receptacles and manifold may be controllably heated to melt the resin material and maintain temperatures to facilitate resin transfer into the component cores.
    Type: Grant
    Filed: April 25, 2024
    Date of Patent: March 3, 2026
    Assignee: KUKA Systems North America LLC
    Inventors: Brian E. Connolly, Corey Michael Buczek
  • Publication number: 20250332771
    Abstract: A transfer molding system includes a plurality of resin receptacles selectively movable by a resin support into registration with a first actuator for dispensing resin material through a transfer manifold and into a component core. Two or more component cores are supported on a core support for selective movement to a position for receiving resin material dispensed through the manifold. The resin receptacles and manifold may be controllably heated to melt the resin material and maintain temperatures to facilitate resin transfer into the component cores.
    Type: Application
    Filed: April 25, 2024
    Publication date: October 30, 2025
    Applicant: KUKA Systems North America LLC
    Inventors: Brian E. Connolly, Corey Michael Buczek