Patents by Inventor Corey PETERSON

Corey PETERSON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9515463
    Abstract: A motor control center system is provided. The system includes an electrical enclosure having buses for routing electrical power to component units. The system also includes a component unit disposed in a compartment of the electrical enclosure. The component unit contains a component for managing a power supply to a load disposed outside of the enclosure. In addition, the system includes a ground element disposed along a support wall of the compartment, wherein the ground element provides a fused ground connection with a load terminal of the electrical enclosure when the component unit is withdrawn from the electrical enclosure.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: December 6, 2016
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Paul T. Krause, Peter J. Halpin, Corey A. Peterson, Michael R. Host, Sam Newbauer
  • Publication number: 20150380912
    Abstract: A motor control center system is provided. The system includes an electrical enclosure having buses for routing electrical power to component units. The system also includes a component unit disposed in a compartment of the electrical enclosure. The component unit contains a component for managing a power supply to a load disposed outside of the enclosure. In addition, the system includes a ground element disposed along a support wall of the compartment, wherein the ground element provides a fused ground connection with a load terminal of the electrical enclosure when the component unit is withdrawn from the electrical enclosure.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Paul T. Krause, Peter J. Halpin, Corey A. Peterson, Michael R. Host, Sam Newbauer
  • Patent number: 8056795
    Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: November 15, 2011
    Assignee: Rockwell Automation Technologies, Inc.
    Inventor: Corey A. Peterson
  • Publication number: 20110143021
    Abstract: A conformal coating system and method for coating a printed circuit board (PCB) is provided. The system comprises a coating station configured to coat the PCB with a coating material and without cleaning the PCB with a saponifier. A surface energy of the PCB is maintained above a target surface energy at least through the cleaning station to promote adhesion of the coating material.
    Type: Application
    Filed: December 15, 2009
    Publication date: June 16, 2011
    Applicant: Rockwell Automation Technologies, Inc.
    Inventors: Corey A. Peterson, Martha A. Maxwell, Bruce W. Weiss
  • Publication number: 20110024482
    Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.
    Type: Application
    Filed: July 29, 2009
    Publication date: February 3, 2011
    Applicant: Rockwell Automation Technologies, Inc.
    Inventor: Corey A. Peterson
  • Publication number: 20100110650
    Abstract: Disclosed herein is a method for forming solder joints including providing a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces. The printed circuit board supports on the first outer surface at least one electronic component having a plurality of leads, and further includes a plurality of through-hole clusters. Each through-hole cluster is associated with a single lead and includes a central hole portion surrounded by a plurality of other hole portions. A plurality of solder joints is formed by subsequently moving the printed circuit board over a wave soldering tank filled with solder. Each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces.
    Type: Application
    Filed: October 31, 2008
    Publication date: May 6, 2010
    Inventors: Martha A. Maxwell, Corey A. Peterson, John N. Bluma