Abstract: An electronic device may have a camera. The camera may capture still and moving images. A camera status indicator may be included in the electronic device. The camera status indicator may emit light to indicate when the camera is in use capturing video or other images. The camera status indicator may have multiple light-emitting devices such as light-emitting diodes or lasers. The light-emitting devices may have different colors. Clear encapsulant may cover the light-emitting devices. A white polymer wall or other light recycling structure may run along an outer peripheral edge of the encapsulant. A light diffusing coating layer may coat an outer surface of the clear encapsulant. Light reflections from the status indicator may be reduced in captured images.

Abstract: A wireless power transmitting device may transmit wireless power signals to a wireless power receiving electronic device. The electronic device may have a coil that receives the transmitted wireless power signals and may have a power receiving circuit that rectifies the received wireless power signals to produce a corresponding direct-current voltage signal. The direct-current signal may be used to power circuitry in the electronic device and may be used to charge a battery in the electronic device. Control circuitry in the electronic device may use a temperature sensor to make temperature measurements. In response to detecting that the device is below a given threshold temperature and based on other information such as information on which applications are running on a controller in device, the device may supply drive current signals to the coil to heat the battery and improve battery performance.

Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

Abstract: A wireless power transmitting device may transmit wireless power signals to a wireless power receiving electronic device. The electronic device may have a coil that receives the transmitted wireless power signals and may have a power receiving circuit that rectifies the received wireless power signals to produce a corresponding direct-current voltage signal. The direct-current signal may be used to power circuitry in the electronic device and may be used to charge a battery in the electronic device. Control circuitry in the electronic device may use a temperature sensor to make temperature measurements. In response to detecting that the device is below a given threshold temperature and based on other information such as information on which applications are running on a controller in device, the device may supply drive current signals to the coil to heat the battery and improve battery performance.

Abstract: Systems and methods for controlling electronic devices using force sensors include a plurality of force sensors configured such that they are operable to support one or more housings on one or more surfaces. When force is exerted on the housing, this force is measured by the force sensors as force data. This force data is interpreted as at least one input for an electronic device. In some implementations, the electronic device may include various different statuses. In such implementations, the status of the electronic device may be determined and the input that the force data is interpreted as may depend on the determined status of the electronic device. In various cases, the status of the electronic device may be a combination of one or more different statuses.