Abstract: The present disclosure relates to a method for smoothing a surface, where the method includes a first depositing onto a first surface of a first layer, resulting in the forming of a second layer on the first surface, where the first depositing is performed using hydride vapor phase epitaxy (HVPE). The first surface is characterized by a first surface feature height and the second layer has a second surface that is characterized by a second surface feature height that is less than the first surface feature height.

Abstract: The present disclosure relates to a composition that includes a III-V planar substrate having a surface aligned with and parallel to a reference plane, where the surface includes a plurality of terraces, each terrace includes a first surface positioned between a first boundary and a second boundary, each boundary is substantially parallel to the other boundaries and positioned substantially parallel to the reference plane, and each terrace is separated from an adjacent terrace by a second surface positioned between the second boundary of the terrace and the first boundary of the adjacent terrace.

Abstract: Described herein are devices and methods for facet suppression in spalling of (100) GaAs by redirecting the fracture front along features created by buried nanoimprint lithography (NIL)-patterned SiO2. Successful facet suppression using patterns that result in favorable fracture along the SiO2/GaAs interface and/or through voids formed above the pattern in the coalesced layer is provided. These results allow for the design of patterns that would successfully interrupt the fracture front and suppress faceting that, combined with growth optimization, define a path forward for this technology to be used as a way to reduce the need for repreparation of the (100) GaAs substrate surface after spalling.

Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.