Abstract: A radar apparatus. The radar apparatus includes a printed circuit board and a signal generating circuit which is disposed at least indirectly on the printed circuit board, is electrically coupled to the printed circuit board, and is configured to generate a radar signal. The radar apparatus additionally includes a waveguide antenna device which is disposed at least indirectly on the printed circuit board and is at least partly formed on the basis of injection-molded plastic. The radar apparatus additionally includes a waveguide coupling device, wherein the signal generating circuit is disposed on or in the waveguide coupling device, and the waveguide coupling device is configured to couple the radar signal generated by the signal generating circuit into the waveguide antenna device.

Abstract: A radar device. The radar device includes a printed circuit board; a signal generation circuit, which is arranged at least indirectly on the printed circuit board, is electrically coupled to the printed circuit board and is designed to generate a radar signal; a waveguide antenna device, which is arranged at least indirectly on the printed circuit board; and a waveguide coupling device, wherein the signal generation circuit is arranged on or in the waveguide coupling device, and wherein the waveguide coupling device is designed to couple the radar signal generated by the signal generation circuit, into the waveguide antenna device.

Abstract: A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.

Abstract: A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.

Abstract: The invention concerns to a method of producing a Fresnel Zone Plate (1) for applications in high energy radiation including the following steps: supply of a substrate (2) transparent for high energy radiation, deposition of a layer (3) of a metal, a metal alloy or a metal compound on a planar surface (4) of the substrate (2), calculating a three dimensional geometrical profile (5) with a mathematical model, setting up a dosage profile (6) for an ion beam of the ion beam lithography inverse to the calculated three dimensional geometrical profile (5) and milling a three dimensional geometrical profile (5) with concentric zones into the layer (3) with ion beam lithography by means of focused ion beam.

Abstract: A method of producing a Fresnel zone plate (15) comprising: making available a substrate (1, 4, 7) which is rotationally symmetrical with respect to its center axis (1a, 4a, 7a); applying layers (2a-d; 5a-d; 8a-d; 11) following in succession by means of an atomic layer deposition (ALD) method to faces (1b-c; 4b-c; 7b-c) of the substrate (1, 4, 7) without rotation of the substrate (1, 4, 7) in order to form a coated substrate, and severing (3a, b; 6a, b; 9a, b) at least one slice (13) from the coated substrate (1, 4, 7), by the coated substrate (1, 4, 7) being divided at least once at a right angle to the center axis (1a, 4a, 7a).

Abstract: The invention concerns to a method of producing a Fresnel Zone Plate (1) for applications in high energy radiation including the following steps: supply of a substrate (2) transparent for high energy radiation, deposition of a layer (3) of a metal, a metal alloy or a metal compound on a planar surface (4) of the substrate (2), calculating a three dimensional geometrical profile (5) with a mathematical model, setting up a dosage profile (6) for an ion beam of the ion beam lithography inverse to the calculated three dimensional geometrical profile (5) and milling a three dimensional geometrical profile (5) with concentric zones into the layer (3) with ion beam lithography by means of focused ion beam.