Patents by Inventor Cormac Walsh

Cormac Walsh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for removing a CMP polishing pad from a platen
    Patent number: 7125326
    Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: October 24, 2006
    Assignee: Ebara Technologies Incorporated
    Inventors: Cormac Walsh, Jun Liu, Gerard Moloney, A. Ernesto Saldana
  • APPARATUS AND METHOD FOR REMOVING A CMP POLISHING PAD FROM A PLATEN
    Publication number: 20050277368
    Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.
    Type: Application
    Filed: June 13, 2005
    Publication date: December 15, 2005
    Applicant: EBARA TECHNOLOGIES INCORPORATED
    Inventors: Cormac Walsh, Jun Liu, Gerard Moloney, A. Ernesto Saldana
  • Slurry distributor for chemical mechanical polishing apparatus and method of using the same
    Publication number: 20050130566
    Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, apparatus (100) includes: (i) platen (106) with polishing surface (110); (ii) head (116) adapted to hold substrate (102) against polishing surface; (iii) mechanism to rotate platen (106) during polishing; (iv) dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) distributor (125) between the nozzles (126, 128) and head (116). In one embodiment, apparatus (100) further includes a wiper (180) between head (116) and distributor (125) to remove used slurry and polishing byproducts from surface (110), thereby reducing agglomerations or deposits that can damage substrate (102) and improving yield. Optionally, apparatus (100) further includes dispenser (186) for dispensing a fluid before and/or after wiper (180) to substantially eliminate buildup of deposits. Method for polishing and substrate polished according to method.
    Type: Application
    Filed: January 25, 2005
    Publication date: June 16, 2005
    Inventors: Jiro Kajiwara, Gerard Moloney, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh, Alejandro Reyes
  • Slurry distributor for chemical mechanical polishing apparatus and method of using the same
    Patent number: 6887132
    Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: May 3, 2005
    Assignee: Multi Planar Technologies Incorporated
    Inventors: Jiro Kajiwara, Gerard Moloney, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh, Alejandro Reyes
  • Method and polishing pad design enabling improved wafer removal from a polishing pad in a CMP process
    Publication number: 20040108063
    Abstract: The invention provides a chemical mechanical polishing pad and method that enables improved wafer removal from the polishing pad after completion of chemical mechanical polishing of the wafer.
    Type: Application
    Filed: March 7, 2003
    Publication date: June 10, 2004
    Applicant: Ebara Technologies
    Inventors: Alejandro Reyes, Gerard Moloney, Cormac Walsh, Ernesto Saldana
  • Slurry distributor for chemical mechanical polishing apparatus and method of using the same
    Publication number: 20030068959
    Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.
    Type: Application
    Filed: September 3, 2002
    Publication date: April 10, 2003
    Inventors: Jiro Kajiwara, Gerard Moloney, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh, Alejandro Reyes