Patents by Inventor Cornel Bozdog
Cornel Bozdog has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250052704Abstract: Determining a property of a layer of an integrated circuit (IC), the layer being formed over an underlayer, is implemented by performing the steps of: irradiating the IC to thereby eject electrons from the IC; collecting electrons emitted from the IC and determining the kinetic energy of the emitted electrons to thereby calculate emission intensity of electrons emitted from the layer and electrons emitted from the underlayer calculating a ratio of the emission intensity of electrons emitted from the layer and electrons emitted from the underlayer; and using the ratio to determine material composition or thickness of the layer. The steps of irradiating IC and collecting electrons may be performed using x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF).Type: ApplicationFiled: August 19, 2024Publication date: February 13, 2025Applicant: NOVA MEASURING INSTRUMENTS INC.Inventors: Wei Ti LEE, Heath POIS, Mark KLARE, Cornel BOZDOG
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Publication number: 20240337590Abstract: A method and system are presented for use in measuring on patterned samples, aimed at determining asymmetry in the pattern. A set of at least first and second measurements on a patterned region of a sample is performed, where each of the measurements comprises: directing illuminating light onto the patterned region along an illumination channel and collecting light reflected from the illuminated region propagating along a collection channel to be detected, such that detected light from the same patterned region has different polarization states which are different from polarization of the illuminating light, and generating a measured data piece indicative of the light detected in the measurement. Thus, at least first and second measured data pieces are generated for the at least first and second measurements on the same patterned region. The at least first and second measured data pieces are analyzed and output data is generated being indicative of a condition of asymmetry in the patterned region.Type: ApplicationFiled: January 29, 2024Publication date: October 10, 2024Applicant: NOVA LTD.Inventors: Dror SHAFIR, Gilad BARAK, Shay WOLFLING, Michal Haim YACHINI, Matthew SENDELBACH, Cornel BOZDOG
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Patent number: 12066391Abstract: Determining a property of a layer of an integrated circuit (IC), the layer being formed over an underlayer, is implemented by performing the steps of: irradiating the IC to thereby eject electrons from the IC; collecting electrons emitted from the IC and determining the kinetic energy of the emitted electrons to thereby calculate emission intensity of electrons emitted from the layer and electrons emitted from the underlayer calculating a ratio of the emission intensity of electrons emitted from the layer and electrons emitted from the underlayer; and using the ratio to determine material composition or thickness of the layer. The steps of irradiating IC and collecting electrons may be performed using x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF).Type: GrantFiled: June 5, 2023Date of Patent: August 20, 2024Assignee: NOVA MEASURING INSTRUMENTS, INC.Inventors: Wei Ti Lee, Heath Pois, Mark Klare, Cornel Bozdog
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Patent number: 11906451Abstract: A monitoring system and method are provided for determining at least one property of an integrated circuit (IC) comprising a multi-layer structure formed by at least a layer on top of an underlayer. The monitoring system receives measured data comprising data indicative of optical measurements performed on the IC, data indicative of x-ray photoelectron spectroscopy (XPS) measurements performed on the IC and data indicative of x-ray fluorescence spectroscopy (XRF) measurements performed on the IC. An optical data analyzer module analyzes the data indicative of the optical measurements and generates geometrical data indicative of one or more geometrical parameters of the multi-layer structure formed by at least the layer on top of the underlayer.Type: GrantFiled: September 20, 2021Date of Patent: February 20, 2024Assignees: Nova Ltd., GLOBALFOUNDRIES U.S. INC.Inventors: Wei Ti Lee, Heath A. Pois, Mark Klare, Cornel Bozdog, Alok Vaid
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Patent number: 11885737Abstract: A method and system are presented for use in measuring on patterned samples, aimed at determining asymmetry in the pattern. A set of at least first and second measurements on a patterned region of a sample is performed, where each of the measurements comprises: directing illuminating light onto the patterned region along an illumination channel and collecting light reflected from the illuminated region propagating along a collection channel to be detected, such that detected light from the same patterned region has different polarization states which are different from polarization of the illuminating light, and generating a measured data piece indicative of the light detected in the measurement. Thus, at least first and second measured data pieces are generated for the at least first and second measurements on the same patterned region. The at least first and second measured data pieces are analyzed and output data is generated being indicative of a condition of asymmetry in the patterned region.Type: GrantFiled: December 28, 2020Date of Patent: January 30, 2024Assignee: Nova Ltd.Inventors: Dror Shafir, Gilad Barak, Shay Wolfling, Michal Haim Yachini, Matthew Sendelbach, Cornel Bozdog
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Publication number: 20230408430Abstract: Determining a property of a layer of an integrated circuit (IC), the layer being formed over an underlayer, is implemented by performing the steps of: irradiating the IC to thereby eject electrons from the IC; collecting electrons emitted from the IC and determining the kinetic energy of the emitted electrons to thereby calculate emission intensity of electrons emitted from the layer and electrons emitted from the underlayer calculating a ratio of the emission intensity of electrons emitted from the layer and electrons emitted from the underlayer; and using the ratio to determine material composition or thickness of the layer. The steps of irradiating IC and collecting electrons may be performed using x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF).Type: ApplicationFiled: June 5, 2023Publication date: December 21, 2023Inventors: Wei Ti Lee, Heath Pois, Mark Klare, Cornel Bozdog
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Patent number: 11668663Abstract: Determining a property of a layer of an integrated circuit (IC), the layer being formed over an underlayer, is implemented by performing the steps of: irradiating the IC to thereby eject electrons from the IC; collecting electrons emitted from the IC and determining the kinetic energy of the emitted electrons to thereby calculate emission intensity of electrons emitted from the layer and electrons emitted from the underlayer calculating a ratio of the emission intensity of electrons emitted from the layer and electrons emitted from the underlayer; and using the ratio to determine material composition or thickness of the layer. The steps of irradiating IC and collecting electrons may be performed using x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF).Type: GrantFiled: January 13, 2020Date of Patent: June 6, 2023Assignee: NOVA MEASURING INSTRUMENTS, INC.Inventors: Wei Ti Lee, Heath Pois, Mark Klare, Cornel Bozdog
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Publication number: 20220074878Abstract: A monitoring system and method are provided for determining at least one property of an integrated circuit (IC) comprising a multi-layer structure formed by at least a layer on top of an underlayer. The monitoring system receives measured data comprising data indicative of optical measurements performed on the IC, data indicative of x-ray photoelectron spectroscopy (XPS) measurements performed on the IC and data indicative of x-ray fluorescence spectroscopy (XRF) measurements performed on the IC. An optical data analyzer module analyzes the data indicative of the optical measurements and generates geometrical data indicative of one or more geometrical parameters of the multi-layer structure formed by at least the layer on top of the underlayer.Type: ApplicationFiled: September 20, 2021Publication date: March 10, 2022Applicants: Nova Ltd., GLOBALFOUNDRIES U.S. INC.Inventors: Wei Lee, Heath A. Pois, Mark Klare, Cornel Bozdog, Alok Vaid
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Publication number: 20210116359Abstract: A method and system are presented for use in measuring on patterned samples, aimed at determining asymmetry in the pattern. A set of at least first and second measurements on a patterned region of a sample is performed, where each of the measurements comprises: directing illuminating light onto the patterned region along an illumination channel and collecting light reflected from the illuminated region propagating along a collection channel to be detected, such that detected light from the same patterned region has different polarization states which are different from polarization of the illuminating light, and generating a measured data piece indicative of the light detected in the measurement. Thus, at least first and second measured data pieces are generated for the at least first and second measurements on the same patterned region. The at least first and second measured data pieces are analyzed and output data is generated being indicative of a condition of asymmetry in the patterned region.Type: ApplicationFiled: December 28, 2020Publication date: April 22, 2021Applicant: NOVA MEASURING INSTRUMENTS LTD.Inventors: Dror SHAFIR, Gilad Barak, Shay WOLFLING, Michal Haim YACHINI, Matthew SENDELBACH, Cornel BOZDOG
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Patent number: 10943907Abstract: Integrated circuitry comprising an array comprises a plurality of conductive vias. Individual of the vias comprise an upper horizontal perimeter comprising opposing end portions. One of the opposing end portions comprises opposing straight sidewalls. The other of the opposing end portions comprises opposing curved sidewalls that join with the opposing straight sidewalls of the one opposing end portion. Other embodiments, including methods, are disclosed.Type: GrantFiled: May 7, 2020Date of Patent: March 9, 2021Assignee: Micron Technology, Inc.Inventors: Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu, Matthew Thorum
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Patent number: 10876959Abstract: A method and system are presented for use in measuring on patterned samples, aimed at determining asymmetry in the pattern. A set of at least first and second measurements on a patterned region of a sample is performed, where each of the measurements comprises: directing illuminating light onto the patterned region along an illumination channel and collecting light reflected from the illuminated region propagating along a collection channel to be detected, such that detected light from the same patterned region has different polarization states which are different from polarization of the illuminating light, and generating a measured data piece indicative of the light detected in the measurement. Thus, at least first and second measured data pieces are generated for the at least first and second measurements on the same patterned region. The at least first and second measured data pieces are analyzed and output data is generated being indicative of a condition of asymmetry in the patterned region.Type: GrantFiled: July 23, 2018Date of Patent: December 29, 2020Assignee: NOVA MEASURING INSTRUMENTS LTD.Inventors: Dror Shafir, Gilad Barak, Shay Wolfling, Michal Haim Yachini, Matthew Sendelbach, Cornel Bozdog
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Publication number: 20200266197Abstract: Integrated circuitry comprising an array comprises a plurality of conductive vias. Individual of the vias comprise an upper horizontal perimeter comprising opposing end portions. One of the opposing end portions comprises opposing straight sidewalls. The other of the opposing end portions comprises opposing curved sidewalls that join with the opposing straight sidewalls of the one opposing end portion. Other embodiments, including methods, are disclosed.Type: ApplicationFiled: May 7, 2020Publication date: August 20, 2020Applicant: Micron Technology, Inc.Inventors: Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu, Matthew Thorum
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Patent number: 10707211Abstract: Integrated circuitry comprising an array comprises a plurality of conductive vias. Individual of the vias comprise an upper horizontal perimeter comprising opposing end portions. One of the opposing end portions comprises opposing straight sidewalls. The other of the opposing end portions comprises opposing curved sidewalls that join with the opposing straight sidewalls of the one opposing end portion. Other embodiments, including methods, are disclosed.Type: GrantFiled: September 24, 2018Date of Patent: July 7, 2020Assignee: Micron Technology, Inc.Inventors: Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu, Matthew Thorum
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Publication number: 20200191734Abstract: Determining a property of a layer of an integrated circuit (IC), the layer being formed over an underlayer, is implemented by performing the steps of: irradiating the IC to thereby eject electrons from the IC; collecting electrons emitted from the IC and determining the kinetic energy of the emitted electrons to thereby calculate emission intensity of electrons emitted from the layer and electrons emitted from the underlayer calculating a ratio of the emission intensity of electrons emitted from the layer and electrons emitted from the underlayer; and using the ratio to determine material composition or thickness of the layer. The steps of irradiating IC and collecting electrons may be performed using x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF).Type: ApplicationFiled: January 13, 2020Publication date: June 18, 2020Inventors: Wei Ti Lee, Heath Pois, Mark Klare, Cornel Bozdog
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Publication number: 20200098761Abstract: Integrated circuitry comprising an array comprises a plurality of conductive vias. Individual of the vias comprise an upper horizontal perimeter comprising opposing end portions. One of the opposing end portions comprises opposing straight sidewalls. The other of the opposing end portions comprises opposing curved sidewalls that join with the opposing straight sidewalls of the one opposing end portion. Other embodiments, including methods, are disclosed.Type: ApplicationFiled: September 24, 2018Publication date: March 26, 2020Applicant: Micron Technology, Inc.Inventors: Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu, Matthew Thorum
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Patent number: 10534275Abstract: A method and system are presented for use in controlling a multiple patterning process of n patterning stages subsequently applied to a sample to produce a target pattern thereon. The method comprises: providing intermediate measured data indicative of an optical response of the sample after being patterned by m-th patterning stage, 1?m<n; processing said intermediate measured data, determining at least a location parameter of a predetermined feature of the pattern, and generating measured data indicative of said at least one selected parameter; utilizing said at least location parameter of the predetermined feature for optimizing a data interpretation model for interpretation of measured data indicative of an optical response from the sample being patterned by k-th subsequent patterning stage, m<k?n.Type: GrantFiled: June 22, 2016Date of Patent: January 14, 2020Assignee: NOVA MEASURING INSTRUMENTS LTD.Inventors: Cornel Bozdog, Aron Cepler, Paul Isbester
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Patent number: 10533961Abstract: Determining a property of a layer of an integrated circuit (IC), the layer being formed over an underlayer, is implemented by performing the steps of: irradiating the IC to thereby eject electrons from the IC; collecting electrons emitted from the IC and determining the kinetic energy of the emitted electrons to thereby calculate emission intensity of electrons emitted from the layer and electrons emitted from the underlayer calculating a ratio of the emission intensity of electrons emitted from the layer and electrons emitted from the underlayer; and using the ratio to determine material composition or thickness of the layer. The steps of irradiating IC and collecting electrons may be performed using x-ray photoelectron spectroscopy (XPS) or x-ray fluorescence spectroscopy (XRF).Type: GrantFiled: November 2, 2016Date of Patent: January 14, 2020Assignee: NOVA MEASURING INSTRUMENTS, INC.Inventors: Wei Ti Lee, Heath Pois, Mark Klare, Cornel Bozdog
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Patent number: 10302414Abstract: A method and system are presented for use in model-based optical measurements in patterned structures. The method comprises: selecting an optimal optical model for interpretation of optical measured data indicative of optical response of the structure under measurements. The selection of the optimal optical model comprises: creating a complete optical model with floating parameters defining multiple configurations of said complete model including one or more model configurations describing an optical response of the structure under measurements, utilizing the complete model for predicting a reference optical response from the structure and generating corresponding virtual reference data, and using the virtual reference data for selecting the optimal optical model for interpretation of the optical measured data.Type: GrantFiled: September 14, 2015Date of Patent: May 28, 2019Assignees: NOVA MEASURING INSTRUMENTS LTD., GLOBALFOUNDRIES INC.Inventors: Gilad Wainreb, Etai Littwin, Alok Vaid, Michael Klots, Cornel Bozdog, Matthew Sendelbach
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Patent number: 10209206Abstract: A control system is presented for use in measuring one or more parameters of a sample. The control system comprises an input utility and a processor utility. The input utility is configured for receiving input data including first data comprising X-ray Diffraction or High-Resolution X-ray Diffraction (XRD) response data of the sample indicative of a material distribution in the sample, and second data comprising optical response data of the sample to incident light indicative of at least a geometry of the sample. The processor utility is configured and operable for processing and analyzing one of the first and second data for optimizing the other one of the first and second data, and utilizing the optimized data for determining said one or more parameters of the sample including a strain distribution in the sample.Type: GrantFiled: July 8, 2014Date of Patent: February 19, 2019Assignee: NOVA MEASURING INSTRUMENTS LTD.Inventors: Gilad Barak, Shay Wolfling, Cornel Bozdog, Matthew Sendelbach
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Patent number: 10197506Abstract: A method and system are presented for use in controlling a process applied to a patterned structure having regions of different layered stacks. The method comprises: sequentially receiving measured data indicative of optical response of the structure being processed during a predetermined processing time, and generating a corresponding sequence of data pieces measured over time; and analyzing and processing the sequence of the data pieces and determining at least one main parameter of the structure.Type: GrantFiled: March 8, 2018Date of Patent: February 5, 2019Assignee: NOVA MEASURING INSTRUMENTS LTD.Inventors: Igor Turovets, Cornel Bozdog, Dario Elyasi