Patents by Inventor Cornelia Retsch

Cornelia Retsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9155206
    Abstract: In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1).
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: October 6, 2015
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Mitja Rateiczak, Bernhard Reul, Cornelia Retsch
  • Publication number: 20100319977
    Abstract: In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1).
    Type: Application
    Filed: December 5, 2008
    Publication date: December 23, 2010
    Inventors: Mitja Rateiczak, Bernhard Reul, Cornelia Retsch