Patents by Inventor Cornelio De Vera

Cornelio De Vera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatuses for singulation of microelectromechanical systems
    Patent number: 5923995
    Abstract: Disclosed are methods and apparatuses that allow the dicing of wafers containing microelectromechanical systems into singulated individual dies that is economic to use and leaves substantially no residue on the surface of the individual dies. A method for packaging the dice singulated according to the present invention is also disclosed.
    Type: Grant
    Filed: April 18, 1997
    Date of Patent: July 13, 1999
    Assignee: National Semiconductor Corporation
    Inventors: Pai-Hsiang Kao, Ranjan J. Mathew, Cornelio De Vera