Abstract: Carbon nanotube reinforced polymers include a polymer and carbon nanotubes reinforcing the polymer. The carbon nanotube reinforced polymer exhibits a conductivity percolation threshold of less than 106 ?/cm at a carbon nanotube content of 1.5 wt. % and less. The polymer may be selected from a polyamide or a polystyrene based polymer. In certain embodiments, the carbon nanotube content is between 0.1 to 1.5 wt. %, and the reinforced polymer will have a percolation threshold at a carbon nanotube content of less than 0.5 wt. %.

Abstract: Carbon nanotube reinforced polymers include a polymer and carbon nanotubes reinforcing the polymer. The carbon nanotube reinforced polymer exhibits a conductivity percolation threshold of less than 106 ?/cm at a carbon nanotube content of 1.5 wt. % and less. The polymer may be selected from a polyamide or a polystyrene based polymer. In certain embodiments, the carbon nanotube content is between 0.1 to 1.5 wt. %, and the reinforced polymer will have a percolation threshold at a carbon nanotube content of less than 0.5 wt. %.

Abstract: The present invention relates to a process for the preparation of a carbon nanotubes reinforced polymer. The process comprises the following steps: a) contacting carbon nanotubes in an aqueous medium with a water-soluble component, comprising either a water-soluble first polymer or a water-soluble surfactant; b) mixing the resulting product from step A) with either an aqueous latex of a second polymer, or with (a) water-soluble precursor(s) of a second polymer; c) removing water from the so obtained mixture; d) heating the product from step C) to a temperature at which the second polymer flows or where the second polymer is formed from out of its precursor(s); and e) processing and/or solidifying the product of step D) into a desired form. As a result the carbon nanotubes retain essentially their original aspect ratio. As a result, mechanical and conductivity properties are improved.

Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least (a) 10-90 wt. % primary aminocarbonamide; (b) 10-90 wt. % aminocarboxylic acid and/or lactam; (c) 0-4 wt. % water; the amounts being relative to the sum of the compounds (a+b+c). Preferably the sum of the compounds (a+b+c) is at least 75 wt. % of the total composition, more preferably 85 wt. %, most preferably 90 wt. %. The polyamide obtained with the process has a &eegr;rel of more than 2.2. The process is eminently suitable for the preparation of polyamide-6 (polycapronamide) from a composition comprising 6-aminocapronamide, 6-aminocaproic acid and/or &egr;-caprolactam. This composition is preferably obtained via the reductive amination of a 5-formylyalerate ester, preferably 5-formylmethylvalerate in water.

Abstract: The invention relates to a polyamide composition with improved flow behavior that comprises at least 80-99.5 wt. % of a high-molecular polyamide and 0.5-20 wt. % of a polyamide oligomer that has a melting point that is higher than the melting point of the high-molecular polyamide, the amounts being relative to the total weight of the polyamide present in the composition. The high-molecular polyamide is preferably PA-6 or PA-4,6/6 copolymer and the polyamide oligomer is preferably chosen from the group comprising PA-6,6, PA-4,6, PA-4,6/6 copolyamide or copolyamides or mixtures thereof.

Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least

Abstract: The invention relates to a polyamide composition with improved flow behaviour that comprises at least 80-99.5 wt. % of a high-molecular polyamide and 0.5-20 wt. % of a polyamide oligomer that has a melting point that is higher than the melting point of the high-molecular polyamide, the amounts being relative to the total weight of the polyamide present in the composition. The high-molecular polyamide is preferably PA-6 or PA-4, 6/6 copolymer and the polyamide oligomer is preferably chosen from the group comprising PA-6, 6, PA-4, 6, PA-4, 6/6 copolyamide or copolyamides or mixtures thereof.

Abstract: Car part made from a polyamide composition wherein the polyamide substantially consists of 60-99 wt. % units derived from aliphatic dicarboxylic acids and diamines and the remaining chain units are derived from cycloaliphatic dicarboxylic acid(s) and an aliphatic diamine or cycloaliphatic diamine(s) and an aliphatic dicarboxylic acid.

Abstract: The invention relates to electrical and electronic components made of a polyamide composition and possessing an improved resistance under soldering conditions, particularly when the surface mounting technique is used. This is achieved by using a polyamide composition whose main chain essentially consists of units derived from aliphatic dicarboxylic acids and diamines or .alpha.,.omega.-amino acids, and in which 1-40% of the chain units are derived from 1,6-cyclohexanedicarboxylic acid and an aliphatic diamine, or from 1,4-cyclohexanediamine and an aliphatic dicarboxylic acid.As a result, the temperature at which blisters are formed during soldering by the infrared method is 20-30.degree. C. higher than in the case of the homo-polyamide.

Abstract: The invention relates to a polymer composition comprising 5 to 79 wt. % of a graft copolymer of vinyl aromatic monomers and monomers chosen from the group of C.sub.1 -C.sub.4 alkyl methacrylates, C.sub.1 -C.sub.4 alkyl acrylates, methacrylonitrile and acrylonitrile on a rubber, 90 to 20 wt. % of a thermoplastic polyamide polymer and 1 to 50 wt. % of a polymer comprising a vinyl aromatic monomer, at least one monomer chosen from the group of C.sub.1 -C.sub.4 alkyl methacrylates, C.sub.1 -C.sub.4 alkyl acrylates, methacrylonitrile and acrylonitrile, and 0.2 to 30 mol % of a compound containing .alpha., .beta.-unsaturated dicarboxylic anhydride, the wt. % of the components being relative to the total weight of the components, characterized in that the composition also comprises at least one monofunctional dicarboxylic-anhydride-containing compound (D) with a weight average molecular weight of less than 1500 g/mol.

Abstract: The invention relates to a polyamide-imide containing recurring units according to the formula ##STR1## where Y is an arylene group, andR and R' are alkylene groups, in which at least 50 mole % of R and/or R' is a butylene group.The polyamide-imides are semi-crystalline.They are suitable for injection moulding applications, structural moulded parts, films, coatings and fibres. They can preferably be used in fields of application where temperatures above 200.degree. C. occur.

Abstract: The invention relates to a thermoplastic polymer composition comprising a polyphenylene oxide; a graft copolymer (A), comprising a copolymer of a vinyl-aromatic compound, a vinyl cyanide and optionally a third monomer and a rubber, whereby the rubber is grafted on the backbone to the copolymer; and a graft copolymer (B) having polystyrene chains grafted on a copolymer backbone which contains units of a vinyl-aromatic compound and units of an .alpha.,.beta.-unsaturated dicarboxylic anhydride. The presence of graft copolymer (B) in the polymer composition causes a significant improvement of the notched impact resistance.

Abstract: The invention relates to a polyimide substantially built up from monomeric units of 3,3',4,4'-benzophenonetetracarboxylic dianhydride and monomeric units of a primary aliphatic diamine. The polyimide according to the invention is characterized in that the primary aliphatic diamine is substantially 1,4-diaminobutane. The thermal stability of the polyimide according to the invention has surprisingly been found to be very good. Owing to this very good thermal stability, the polyimides according to the invention can very well be processed at--relatively--high processing temperatures without any appreciable thermal degradation of the polyimide. As a result, the polyimides processing potential has increased considerably. Also, articles made of the polyimides according to the invention can be used at significantly higher temperatures. Said articles have very good mechanical properties. Articles containing a polyimide are suited for being used in the most diverse applications.