Abstract: An electrically heated soldering iron which is particularly adapted for surface mounting components on printed circuit boards. A unitary member rotatably joins together a pair of channel-shaped arms and resiliently biases the arms in a normally open position which is defined by a pair of overlapping members in the center portion of the iron. The arms are selectively moveable by a user toward each other to a closed position and the channel portions of the arms are adapted to retain the unitary member, the pair of overlapping members, and detachable assemblies of U-shaped soldering tips for applying heat to surface mounted electronic components. The U-shaped soldering tips are comprised of dissimilar conductors joined together to unitarily provide a soldering tip, heating element for heating the tip and a thermocouple for sensing the temperature of the tip.

Abstract: A temperature controlled soldering iron wherein the same pair of dissimilar conductors, joined together, unitarily provides a soldering tip, a heating element for heating the soldering tip and a thermocouple for sensing the temperature of the soldering tip. When current is supplied to the conductors, a temperature effect is produced which is in addition to the normal heating of the conductors and results in a corresponding voltage which varies directly with the temperature of the conductors. The voltage is applied to a control circuit where it is amplified, compared against a reference voltage, corresponding to a pre-selected soldering temperature, and the voltage derived from said comparison is applied to regulating the current used for heating the dissimilar conductors. The dissimilar conductors are formed from wires of dissimilar metals and mounted in a generally cylindrical handle by a means which minimizes handle temperatures.