Abstract: A method of manufacturing a travelling wave parametric amplifier (TWPA) includes forming a superconducting junction on a substrate. Trenches are etched away through a metal surface and into a layer of dielectric material. The trenches define a plurality of fingers positioned in an interdigitated arrangement of capacitors defined by a metal and a dielectric material that remains from the etched away metal surface and the layer of dielectric material.

Abstract: One or more systems, devices and/or methods of use provided herein relate to a device that can provide bandwidth and/or saturation power to amplify a plurality of readout frequencies or to convert one or more frequencies. In quantum technology, the one or more systems, devices and/or methods of use provided herein can be employed to simultaneously readout a plurality of qubit resonators. A device can comprise a Josephson parametric converter device comprising a Josephson ring modulator having a pair of nodes, and an impedance matching circuit network operatively connected across the pair of nodes. The device can be separately operable in an amplification mode or in a conversion mode.

Abstract: A Traveling Wave Parametric Amplifier (TWPA) transmission line with improved bandwidth includes one or more unit cell. Each unit cell includes a capacitor to a ground and a Josephson junction in series configured to provide inductance and non-linearity. One or more dispersion resonator is coupled to the transmission line. The dispersion resonator is configured to (i) use a first harmonic mode of the resonator for resonant phase matching in the transmission line and (ii) prevent a second mode of the resonator from interacting with an intermodulation product of the transmission line.

Abstract: A superconducting electrical device includes one or more traveling-wave parametric amplifiers (TWPAs) on a chip that is electrically connected to a wiring layer of a substrate. The electrical connection of the chip to the wiring layer of the substrate includes, for each of the one or more TWPAs, a signal bump-bond between the TWPA and the substrate. There is a peripheral ring of ground bumps around the signal bump between the TWPA and the substrate.

Abstract: One or more systems, devices and/or methods of use provided herein relate to a device that can provide bandwidth and/or saturation power to amplify a plurality of readout frequencies or to convert one or more frequencies. In quantum technology, the one or more systems, devices and/or methods of use provided herein can be employed to simultaneously readout a plurality of qubit resonators. A device can comprise a Josephson parametric converter device comprising a Josephson ring modulator having a pair of nodes, and an impedance matching circuit network operatively connected across the pair of nodes. The device can be separately operable in an amplification mode or in a conversion mode.

Abstract: Devices and/or computer-implemented methods to facilitate a Josephson traveling wave parametric amplifier (JTWPA) device with sideband suppression are provided. According to an embodiment, a device can comprise a plurality of unit cells including at least one Josephson junction and a shunt capacitor. The device can further comprise a plurality of first dispersion resonators coupled to the plurality of unit cells at a first interval. The plurality of first dispersion resonators suppress generation of at least one of a third order harmonic of a pump tone applied to the device, a third order intermodulation product, or a fifth order intermodulation product.