Patents by Inventor Cory Bendokas

Cory Bendokas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interface transition and environmental barrier
    Patent number: 11821200
    Abstract: An interface transition for use in compression in connection with panels where air and/or water penetration is undesirable having a first body, a second body, an adhesive layer positioned intermediate the first body and the second body, and an impregnation into at least the first body, wherein the combination of the bodies, adhesive layer and impregnation reduces the air leakage rate therethrough and moisture infiltration therein after the interface transition is compressed to a width 75% of its uncompressed width. The interface transition may include an extension member for splicing and construction of a four-way intersection.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: November 21, 2023
    Assignee: Schul International Co., LLC
    Inventors: Nicholas A Fiorilla, Michael M. Sebold, Brian J. Iske, Chad Heikkila, Donald Wallis, Stephen M. Pierson, Adam Milter, Phillip David Effler, Cory Bendokas
  • Interface Transition and Environmental Barrier
    Publication number: 20230272614
    Abstract: An interface transition for use in compression in connection with panels where air and/or water penetration is undesirable having a first body, a second body, an adhesive layer positioned intermediate the first body and the second body, and an impregnation into at least the first body, wherein the combination of the bodies, adhesive layer and impregnation reduces the air leakage rate therethrough and moisture infiltration therein after the interface transition is compressed to a width 75% of its uncompressed width. The interface transition may include an extension member for splicing and construction of a four-way intersection.
    Type: Application
    Filed: February 28, 2022
    Publication date: August 31, 2023
    Applicant: Schul International Co., LLC
    Inventors: Nicholas A. Fiorilla, Michael M. Sebold, Brian J. Iske, Chad Heikkila, Donald Wallis, Stephen M. Pierson, Adam Milter, Phillip David Effler, Cory Bendokas