Abstract: Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include, but are not limited to, structural features such as interfaces, grain boundaries, and point scattering sites, for example, that are designed to scatter heat carriers while allowing electrons to pass through the material. Some embodiments herein involve designing selected stacks of alternating or sequential material pairs within sensor interconnects.

Abstract: Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include the use of an electrically conductive alloy material or intermetallic material of at least two or more elements to promote scattering of phonons. These materials are selected to scatter heat carriers while allowing electrons to pass through the material.

Abstract: A microelectromechanical system (MEMS) actuator device includes a substrate; a shape memory alloy over the substrate; and a reflective coating on the shape memory alloy. The shape memory alloy and the reflective coating form a bi-layer cantilever beam having a first end anchored to the substrate, and a second end released from the substrate. The second end of the cantilever beam articulates between a deflection configuration away from the substrate and a non-deflection configuration towards the substrate based on a thermal phase change in the shape memory alloy.