Patents by Inventor Cosimo Cantatore

Cosimo Cantatore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and structure for a 3D wire block
    Patent number: 10559476
    Abstract: The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: February 11, 2020
    Inventors: Donald Thompson, Cosimo Cantatore
  • METHOD AND STRUCTURE FOR A 3D WIRE BLOCK
    Publication number: 20180068867
    Abstract: The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.
    Type: Application
    Filed: August 28, 2017
    Publication date: March 8, 2018
    Inventors: Donald Thompson, Cosimo Cantatore
  • Circuit board stiffener
    Patent number: 7381908
    Abstract: Embodiments of the present invention provide improved circuit board stiffeners. In one embodiment the present invention includes a circuit board stiffener comprising a lower stiffener piece having a first lower surface for abutting an upper surface of a test system and a first upper surface, and at least one upper stiffener piece having a second lower surface for abutting the first upper surface of the lower stiffener piece and a second upper surface for attaching to a circuit board.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: June 3, 2008
    Inventors: Cosimo Cantatore, Mohsen H Mardi, David M Mahoney