Abstract: A differential liquid pressure sensor (10) has an upper housing (12) that mounts a connector portion (12a) and receives in a recess a sense element module (14). The sense element module is a body in which a generally U-shaped oil filled passageway (14h) is formed with openings at opposite ends provided on respective first and second diaphragm mounting surfaces. A fluid pressure sense element, such as a piezoresistive sense element (15) is disposed in one of the passageway openings and flexible metal diaphragms (14a, 14b) are mounted on the respective diaphragm mounting surfaces of the module facing a common direction. A lower housing (18) having first and second port connections for the respective diaphragms is disposed on the lower surface of the module.

Abstract: A differential liquid pressure sensor (10) has an upper housing (12) that mounts a connector portion (12a) and receives in a recess a sense element module (14). The sense element module is a body in which a generally U-shaped oil filled passageway (14h) is formed with openings at opposite ends provided on respective first and second diaphragm mounting surfaces. A fluid pressure sense element, such as a piezoresistive sense element (15) is disposed in one of the passageway openings and flexible metal diaphragms (14a, 14b) are mounted on the respective diaphragm mounting surfaces of the module facing a common direction. A lower housing (18) having first and second port connections for the respective diaphragms is disposed on the lower surface of the module.

Abstract: Highly corrosion resistant electrically conductive contact systems suitable for semiconductor pressure sensor devices exposed to acidic, elevated temperature environments, such as automotive exhaust gas environments, are disclosed. The preferred embodiment (10) comprises a platinum top layer (26), and a tantalum lower layer (24). Both are highly electrically conductive layers and exhibit corrosion resistance to acidic environments. The top layer of the metallization also provides a suitable material for the external connectivity (e.g., wire bonding, solder bumping, chip-chip fusion). The lower layer of the metallization also serves as an adhesion layer between the top metal and lower layers, typically silicon based glasses and in some cases serves as a diffusion barrier.