Abstract: An automatic wireless fine-grained ratio map construction and adaptation system may include a Gaussian process regression (GPR) model constructed with real wireless received signal strength (RSS) measurements collected in a free space to provide coarse RSS estimation in a constrained space, and a generative adversarial network (GAN) to provide fine-grained RSS estimation in the constrained space by using an output of GPR as an input for a generator of GAN, modeling the irregular RSS distributions in complex indoor environments. The system may generate realistic RSS data in the constrained space that has not been manually site-surveyed.

Abstract: An automatic wireless fine-grained ratio map construction and adaptation system may include a Gaussian process regression (GPR) model constructed with real wireless received signal strength (RSS) measurements collected in a free space to provide coarse RSS estimation in a constrained space, and a generative adversarial network (GAN) to provide fine-grained RSS estimation in the constrained space by using an output of GPR as an input for a generator of GAN, modeling the irregular RSS distributions in complex indoor environments. The system may generate realistic RSS data in the constrained space that has not been manually site-surveyed.

Abstract: A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and may include a transducer coupled to the at least one sensing element. The transducer can be configured to receive a signal from the sensing element and convert the signal into a second signal for input to the information processor.

Abstract: A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and may include a transducer coupled to the at least one sensing element. The transducer can be configured to receive a signal from the sensing element and convert the signal into a second signal for input to the information processor.

Abstract: A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and may include a transducer coupled to the at least one sensing element. The transducer can be configured to receive a signal from the sensing element and convert the signal into a second signal for input to the information processor.

Abstract: A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and may include a transducer coupled to the at least one sensing element. The transducer can be configured to receive a signal from the sensing element and convert the signal into a second signal for input to the information processor.

Abstract: A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and at least one transducer coupled to the at least one sensing element. The transducer is configured so as to receive a signal from the sensing element and converting the signal into a second signal for input to the information processor.

Abstract: One aspect of the present invention is a method of monitoring processes, optimizing processes, and diagnosing problems in the performance of a process tool for processing a workpiece. Another aspect of the present invention is a system configured for monitoring processes, optimizing processes, and diagnosing problems in the performance of a process tool for processing a workpiece. One embodiment of the present invention includes a software program that can be implemented in a computer for optimizing the performance of a process tool for processing a workpiece.

Abstract: One aspect of the present invention is a method of monitoring processes, optimizing processes, and diagnosing problems in the performance of a process tool for processing a workpiece. Another aspect of the present invention is a system configured for monitoring processes, optimizing processes, and diagnosing problems in the performance of a process tool for processing a workpiece. One embodiment of the present invention includes a software program that can be implemented in a computer for optimizing the performance of a process tool for processing a workpiece.

Abstract: Presented are methods, systems, and apparatuses for managing and maintaining an electronic device such as a sensor apparatus.

Abstract: Presented are methods and apparatus for controlling the processing of a substrate during a process step that is sensitive to one or more process conditions. One embodiment includes a method performed with corresponding apparatus that includes a controller. One step includes constructing a perturbation model relating changes in control parameters for the apparatus to one or more resulting changes in the process. The method also includes the step of using the perturbation model with at least one of a performance objective and a constraint to derive optimized control parameters for the controller. Another step in the method includes operating the controller with the optimized control parameters. Another embodiment includes an apparatus for processing substrates where the apparatus comprises optimized control parameters.

Abstract: This invention seeks to provide methods and apparatus that can improve the accuracy of measured parameter data used for processing workpieces. One aspect of the present invention includes methods of measuring process conditions with low distortion of the measurements caused by the measuring apparatus. The measurements include data for applications such as data for monitoring, controlling, and optimizing processes and process tools. Another aspect of the present invention includes apparatus for measuring substantially correct data for applications such as generating data for monitoring, controlling, and optimizing processes and process tools.

Abstract: Presented are methods, systems, and apparatuses for managing and maintaining an electronic device such as a sensor apparatus.

Abstract: Presented are methods and apparatus for controlling the processing of a substrate during a process step that is sensitive to one or more process conditions. One embodiment includes a method performed with corresponding apparatus that includes a controller. One step includes constructing a perturbation model relating changes in control parameters for the apparatus to one or more resulting changes in the process. The method also includes the step of using the perturbation model with at least one of a performance objective and a constraint to derive optimized control parameters for the controller. Another step in the method includes operating the controller with the optimized control parameters. Another embodiment includes an apparatus for processing substrates where the apparatus comprises optimized control parameters.

Abstract: Presented are methods, systems, and apparatuses for managing and maintaining an electronic device such as a sensor apparatus.

Abstract: Presented are methods and apparatus for controlling the processing of a substrate during a process step that is sensitive to one or more process conditions. One embodiment includes a method performed with corresponding apparatus that includes a controller. One step includes constructing a perturbation model relating changes in control parameters for the apparatus to one or more resulting changes in the process. The method also includes the step of using the perturbation model with at least one of a performance objective and a constraint to derive optimized control parameters for the controller. Another step in the method includes operating the controller with the optimized control parameters. Another embodiment includes an apparatus for processing substrates where the apparatus comprises optimized control parameters.

Abstract: Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measure data so as to provide corrected parameter data having increased accuracy. One embodiment uses warpage geometry to derive the correction factors.

Abstract: Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measured data so as to provide corrected parameter data having increased accuracy.

Abstract: Data are collected for deriving response models and information required for developing and maintaining processes and process tools. Methods and apparatus for collecting the data include a sensor apparatus capable of collecting data with less perturbation and fewer disruptions than is usually possible using standard methods. The sensor apparatus is capable of being loaded into a process tool. From within the process tool, the sensor apparatus is capable of measuring data, processing data, storing data, and transmitting data. The sensor apparatus has capabilities for near real time data collection and communication.

Abstract: Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measured data so as to provide corrected parameter data having increased accuracy.