Patents by Inventor Courtney Elliott

Courtney Elliott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943869
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: March 26, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott
  • Publication number: 20230276574
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 31, 2023
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott
  • Publication number: 20210243897
    Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 5, 2021
    Inventors: Brandon Summey, Peter A. Blais, Robert Andrew Ramsbottom, Jeffrey Poltorak, Courtney Elliott