Patents by Inventor Courtney Michael Hazelton

Courtney Michael Hazelton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7572735
    Abstract: Yield loss in semiconductor processing is mitigated by forming a resist over an active side of a semiconductor workpiece or wafer, as well as around the edge of the wafer. The resist mitigates the creation of contaminants, such as nitride flakes, for example, that can develop when an oxide, nitride, oxide (ONO) layer is removed from the back or in-active side of the wafer. In the absence of the resist, such flakes may migrate to the front or active side of the wafer and cause defects to form therein, which can result in yield loss.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: August 11, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Scott Cuong Nguyen, Keith David Fenstermacher, David Michael Smith, Courtney Michael Hazelton
  • Patent number: 7573086
    Abstract: A capacitor is disclosed that is formed as part of an integrated circuit (IC) fabrication process. The capacitor generally comprises a top conductive plate, a capacitor dielectric and a bottom conductive plate that respectively comprise a patterned layer of tantalum nitride TaN, a layer of a nitride based material and a layer of patterned polysilicon.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: August 11, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Michael LeRoy Huber, Gregory Lee Hendy, Evelyn Anne Lafferty, George Nicholas Harakas, Salvatore Frank Pavone, Blake Ryan Pasker, Courtney Michael Hazelton, James Wayne Klawinsky
  • Publication number: 20080076254
    Abstract: Yield loss in semiconductor processing is mitigated by forming a resist over an active side of a semiconductor workpiece or wafer, as well as around the edge of the wafer. The resist mitigates the creation of contaminants, such as nitride flakes, for example, that can develop when an oxide, nitride, oxide (ONO) layer is removed from the back or in-active side of the wafer. In the absence of the resist, such flakes may migrate to the front or active side of the wafer and cause defects to form therein, which can result in yield loss.
    Type: Application
    Filed: September 27, 2006
    Publication date: March 27, 2008
    Inventors: Scott Cuong Nguyen, Keith David Fenstermacher, David Michael Smith, Courtney Michael Hazelton