Abstract: A climate control system for electronic equipment may include an electronic equipment room including a plurality of peripheral walls defining a chamber configured to receive a plurality of pieces of electronic equipment and having one or more interior partitions dividing the chamber into two or more subchambers. In addition, the system may also include a cooling system configured to provide the two or more subchambers with different levels of cooling, wherein at least one partition of the one or more interior partitions is movable from a first position defining a first subchamber to a second position defining a second subchamber in a different area of the room than the first subchamber.

Abstract: A system to improve cooling of rack mounted components may include a first rack mounted component including a first motherboard, the first motherboard having a hot area that is generally hotter than other portions of the motherboard, the hot area proximate a first edge. In addition, the system may include a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard, wherein the second motherboard is similar to the first motherboard; the second motherboard having a first edge; wherein the second motherboard is disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard.