Patents by Inventor C. P. Lo

C. P. Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030011998
    Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.
    Type: Application
    Filed: August 30, 2002
    Publication date: January 16, 2003
    Applicant: Hughes Electronics Corporation
    Inventors: C. P. Lo, Daniel A. Huang, Pete Hudson
  • Publication number: 20010046120
    Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.
    Type: Application
    Filed: February 16, 2000
    Publication date: November 29, 2001
    Inventors: C. P. Lo, Daniel A. Huang, Pete Hudson
  • Patent number: 5770817
    Abstract: A raceway box with replaceable cable and connector receptacles is provided. The raceway box allows easy replacement of various types of connectors when necessary. Further, the raceway box can provide inlet/outlet openings in various directions based on on-site requirements. The interior space of the raceway box is extendible so as to accommodate a large volume of interconnecting cables and wires. The raceway box is composed of a base unit, a plurality of inserts including cable raceway inserts and connector raceway inserts inset on the lateral sides of the raceway box, and a socket panel covering the base unit. The base unit includes a chassis having a plurality of side pieces mounted substantially upright on the edge of said chassis. These side pieces define a corresponding number of receptacles therebetween. The cable raceway insert is used to receive at least a cable into the raceway box, and the connector raceway insert is used to mount one connector therein.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: June 23, 1998
    Inventor: Jeffrey C. P. Lo
  • Patent number: D349100
    Type: Grant
    Filed: April 23, 1993
    Date of Patent: July 26, 1994
    Assignee: Unicom Electric, Inc.
    Inventor: Jeffrey C.-P. Lo