Patents by Inventor Craig A. Stephen

Craig A. Stephen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package with reinforced positive alignment features
    Patent number: 8659161
    Abstract: A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 25, 2014
    Assignee: Oracle International Corporation
    Inventors: Ashok V. Krishnamoorthy, Craig A. Stephen, John E. Cunningham, James G. Mitchell
  • CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES
    Publication number: 20120326322
    Abstract: A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 27, 2012
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Ashok V. Krishnamoorthy, Craig A. Stephen, John E. Cunningham, James G. Mitchell