Patents by Inventor Craig B. Simmons

Craig B. Simmons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Short carbon fiber enhanced thermal grease
    Publication number: 20040060691
    Abstract: A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 1, 2004
    Applicant: Intel Corporation
    Inventors: Chia-Pin Chiu, James C. Shipley, Craig B. Simmons
  • Short carbon fiber enhanced thermal grease
    Patent number: 6651736
    Abstract: A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: November 25, 2003
    Assignee: Intel Corporation
    Inventors: Chia-Pin Chiu, James C. Shipley, Craig B. Simmons
  • Thermal interface material on a mesh carrier
    Patent number: 6523608
    Abstract: A thermal interface comprising a grid frame having a thermally conductive interface material coated thereon. The thermal interface is disposed between a heat source and a heat dissipation device wherein the thermally conductive material preferably melts at a temperature at or below the temperature of the heat source.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: February 25, 2003
    Assignee: Intel Corporation
    Inventors: Gary L. Solbrekken, Craig B. Simmons, Chia-Pin Chiu
  • Short carbon fiber enhanced thermal grease
    Publication number: 20030000690
    Abstract: A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.
    Type: Application
    Filed: June 28, 2001
    Publication date: January 2, 2003
    Applicant: Intel Corporation
    Inventors: Chia-Pin Chiu, James C. Shipley, Craig B. Simmons