Abstract: In accordance with at least one embodiment, a clock counter on a system (for example, a system-on-a-chip (SOC) or other system) is utilized to count a number of a clock edges of a memory clock within a predefined time based on a predetermined system clock frequency and, therefore, to determine whether the memory clock for a memory array (for example, a non-volatile memory (NVM) array or other memory array) is correct or not. The system is directed to wait until the count is within an expected range before moving to the next step in a start-up procedure. If the maximum allowed start-up time is exceeded, an error signal is sent to the system such that the application can react to it.

Abstract: In accordance with at least one embodiment, a clock counter on a system (for example, a system-on-a-chip (SOC) or other system) is utilized to count a number of a clock edges of a memory clock within a predefined time based on a predetermined system clock frequency and, therefore, to determine whether the memory clock for a memory array (for example, a non-volatile memory (NVM) array or other memory array) is correct or not. The system is directed to wait until the count is within an expected range before moving to the next step in a start-up procedure. If the maximum allowed start-up time is exceeded, an error signal is sent to the system such that the application can react to it.

Abstract: A memory has an array of memory cells, column logic, a write driver, a voltage detector, and a bootstrap circuit. The array of memory cells is coupled to pairs of bit lines and word lines. The column logic is coupled to the array and is for coupling a selected pair of bit lines to a pair of data lines. The write driver is coupled to the pair of data lines. The voltage detector provides an initiate boost signal when a voltage of a first data line of the pair of data lines drops below a first level during the writing of the pair of data lines by the write driver. The bootstrap circuit reduces the voltage of the first data line in response to the boost enable signal. This is particularly beneficial when the number of memory cells on a bit line can vary significantly as in a compiler.

Abstract: A memory has an array of memory cells, column logic, a write driver, a voltage detector, and a bootstrap circuit. The array of memory cells is coupled to pairs of bit lines and word lines. The column logic is coupled to the array and is for coupling a selected pair of bit lines to a pair of data lines. The write driver is coupled to the pair of data lines. The voltage detector provides an initiate boost signal when a voltage of a first data line of the pair of data lines drops below a first level during the writing of the pair of data lines by the write driver. The bootstrap circuit reduces the voltage of the first data line in response to the boost enable signal. This is particularly beneficial when the number of memory cells on a bit line can vary significantly as in a compiler.

Abstract: A memory circuit has a memory array with a first line of memory cells, a second line of memory cells, a first power supply terminal, a first capacitance structure, a first power supply line coupled to the first line of memory cells; and a second power supply line coupled to the second line of memory cells. For the case where the second line of memory cells is selected for writing, a switching circuit couples the power supply terminal to the first power supply line, decouples the first power supply line from the second line of memory cells, and couples the second power supply line to the first capacitance structure. The result is a reduction in power supply voltage to the selected line of memory cells by charge sharing with the capacitance structure. This provides more margin in the write operation on a cell in the selected line of memory cells.

Abstract: In one embodiment, delamination of a patterned silicon nitride anti-reflective layer (26) from an underlying patterned tungsten silicide layer (32), is prevented by forming a thin silicon layer (30) between the patterned tungsten silicide layer (32) and the overlying patterned silicon nitride anti-reflective layer (26).

Abstract: In one embodiment, delamination of a patterned silicon nitride anti-reflective layer (26) from an underlying patterned tungsten silicide layer (32), is prevented by forming a thin silicon layer (30) between the patterned tungsten silicide layer (32) and the overlying patterned silicon nitride anti-reflective layer (26).