Abstract: A medication system includes a blister pack. The blister pack includes a sheet containing a plurality of blisters each respectively containing at least one medication. The blister pack further includes a backing positioned on the sheet and a substrate layer having electronic circuitry thereon, the circuitry including traces terminating at one end at positions corresponding to each of the blisters. The blister pack is connected to an edge connector disposed adjacent to an edge of the sheet, the traces terminating at an other end to the edge connector. The medication system also includes a hub in electronic communication with the blister pack. The traces positioned such that each time a blister is punctured, the breakage event is communicated to the hub and recorded.