Patents by Inventor Craig Davell Petersen

Craig Davell Petersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Expandable audio visual adapter module with multi-port voltage and power management circuitry
    Patent number: 10468842
    Abstract: A USB Type-C audio-visual adapter system includes a base module and an expansion module. The base module has a first housing with a first face and a second face, where the first face includes USB and A/V connectors and the second face includes a first expansion connector. The second face is offset inwardly from an edge of the first housing defined by a lip extending about the second face. The expansion module has a second housing with a first face that includes a second expansion connector, where the first face of the second housing is configured to be received within a recessed area formed by the lip of first housing to facilitate mechanical and electrical coupling of the first and second expansion connectors.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: November 5, 2019
    Assignee: Ortronics, Inc.
    Inventors: Child Kuan Leok Sun, Craig Davell Petersen, Taesuk Yang, Dana Wren York, Jennifer Dawn Crotinger, Terry Lynn Smith, Garry Dukes
  • Expandable Audio Visual Adapter Module With Multi-Port Voltage and Power Management Circuitry
    Publication number: 20180198248
    Abstract: A USB Type-C audio-visual adapter system includes a base module and an expansion module. The base module has a first housing with a first face and a second face, where the first face includes USB and A/V connectors and the second face includes a first expansion connector. The second face is offset inwardly from an edge of the first housing defined by a lip extending about the second face. The expansion module has a second housing with a first face that includes a second expansion connector, where the first face of the second housing is configured to be received within a recessed area formed by the lip of first housing to facilitate mechanical and electrical coupling of the first and second expansion connectors.
    Type: Application
    Filed: January 12, 2017
    Publication date: July 12, 2018
    Applicant: Ortronics, Inc.
    Inventors: Child Kuan Leok Sun, Craig Davell Petersen, Terry Lynn Smith, Dana Wren York, Taesuk Yang, Jennifer Dawn Crotinger, Garry Dukes