Patents by Inventor Craig Deschenes

Craig Deschenes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050266161
    Abstract: A method is provided for the fabrication of a fibrous structure. Fibers are deposited in a hopper connected to an electrode. A mesh covers the hopper opening and the hopper is inverted and suspended over an adhesive coated substrate. An electric field is generated between the hopper and the substrate while the hopper is simultaneously shaken. As a result, fibers fall through the mesh, aligned along the electric field lines, travel through the electric field, and are coupled on one end thereof to the adhesive.
    Type: Application
    Filed: May 18, 2004
    Publication date: December 1, 2005
    Inventors: Maria Medeiros, Eric Dow, Russell Bessette, Craig Deschenes, Christopher Lafratta, Armand Lewis, Yong Kim