Patents by Inventor Craig Dumas

Craig Dumas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planar interconnect structure for hybrid circuits
    Patent number: 8546186
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: October 1, 2013
    Assignee: Starkey Laboratories, Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • Hearing assistance device with stacked die
    Patent number: 8369553
    Abstract: The present subject matter relates to a hearing assistance device for an ear of a wearer comprising a microphone for receiving sound, hearing assistance electronics in communications with the microphone, the hearing assistance electronics including a hybrid circuit, and a wearable housing adapted to house at least the hearing assistance electronics. The hybrid circuit comprises a first integrated circuit die having one or more through-silicon-vias (TSVs), a first redistribution layer disposed on a surface of the first integrated circuit, and a second integrated circuit die having one or more contacts, the second integrated circuit die disposed on the first redistribution layer, wherein the first redistribution layer is adapted to connect one or more of the one or more TSVs of the first integrated circuit die to one or more of the one or more contacts of the second integrated circuit die.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: February 5, 2013
    Assignee: Starkey Laboratories, Inc.
    Inventors: Craig Dumas, Douglas F. Link
  • PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS
    Publication number: 20130005084
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Application
    Filed: March 30, 2012
    Publication date: January 3, 2013
    Applicant: Starkey Laboratories, Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • Planar interconnect structure for hybrid circuits
    Patent number: 8148201
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: April 3, 2012
    Assignee: Starkey Laboratories, Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • HEARING ASSISTANCE DEVICE WITH STACKED DIE
    Publication number: 20100158296
    Abstract: The present subject matter relates to a hearing assistance device for an ear of a wearer comprising a microphone for receiving sound, hearing assistance electronics in communications with the microphone, the hearing assistance electronics including a hybrid circuit, and a wearable housing adapted to house at least the hearing assistance electronics. The hybrid circuit comprises a first integrated circuit die having one or more through-silicon-vias (TSVs), a first redistribution layer disposed on a surface of the first integrated circuit, and a second integrated circuit die having one or more contacts, the second integrated circuit die disposed on the first redistribution layer, wherein the first redistribution layer is adapted to connect one or more of the one or more TSVs of the first integrated circuit die to one or more of the one or more contacts of the second integrated circuit die.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 24, 2010
    Inventors: Craig Dumas, Douglas F. Link
  • PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS
    Publication number: 20100009498
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Application
    Filed: September 21, 2009
    Publication date: January 14, 2010
    Applicant: Starkey Laboratories,Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS
    Publication number: 20080272496
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Application
    Filed: May 2, 2007
    Publication date: November 6, 2008
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • Ring
    Patent number: D807221
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: January 9, 2018
    Inventor: Malcolm Craig Dumas