Patents by Inventor Craig E. Core

Craig E. Core has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flow sensor chip
    Patent number: 7703339
    Abstract: A flow sensor has an inlet chamber with a first pressure sensor and an inlet port for receiving fluid, and an outlet chamber with a second pressure sensor and an outlet port. The flow sensor also has an anemometer in fluid communication with at least one of the two chambers.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: April 27, 2010
    Assignee: Analog Devices, Inc.
    Inventors: Robert E. Sulouff, Jr., Craig E. Core
  • Flow sensor chip
    Publication number: 20080264181
    Abstract: A flow sensor has an inlet chamber with a first pressure sensor and an inlet port for receiving fluid, and an outlet chamber with a second pressure sensor and an outlet port. The flow sensor also has an anemometer in fluid communication with at least one of the two chambers.
    Type: Application
    Filed: December 8, 2006
    Publication date: October 30, 2008
    Inventors: Robert E. Sulouff, Craig E. Core
  • Method of forming a cover cap for semiconductor wafer devices
    Patent number: 6352935
    Abstract: A method for capping active areas of a semiconductor wafer uses photolithography to define areas of sealant on the cap wafer to thereby reduce the amount of space required for attaching the cap wafer to the semiconductor wafer carrying active areas to be capped. Using photolithography in this manner increases the amount of space on the semiconductor wafer that can be used to form active areas which, in turn, improves the density of active area on the semiconductor wafer. In one embodiment, the method includes the steps of applying a photoimageable layer, photoimaging the photoimageable layer to define a pattern including remaining regions of the photoimageable layer and removed regions of the photoimageable layer, and using the pattern to define the sealant regions on the semiconductor wafer.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: March 5, 2002
    Assignee: Analog Devices, Inc.
    Inventors: David J. Collins, Craig E. Core, Lawrence E. Felton, Jing Luo
  • Method of forming a self-aligned capacitor
    Patent number: 5480831
    Abstract: A self-aligned capacitor structure and method of making it includes an insulating support substrate with the capacitor disposed on the insulating substrate with a first conducting extending across the capacitor in the first dimension. The capacitor includes a first electrode interconnected with the first conductor, a second electrode supported by the substrate and interconnected with the second conductor, and a dielectric medium between the first and second electrodes. The first and second electrodes being coterminous in both directions in the first dimension for eliminating parasitic capacitance between the first conductor and the second electrode.
    Type: Grant
    Filed: March 15, 1995
    Date of Patent: January 2, 1996
    Assignee: Analog Devices, Inc.
    Inventor: Craig E. Core