Abstract: A method of fabricating a photonic device includes in part, forming a multitude of metal and dielectric layers over a semiconductor substrate to form a structure. The metal layers form a continuous metal trace that characterize an etch channel. At least one of the metal layers extends towards an exterior surface of the structure such that when the structure is exposed to a metal etch, the metal etch removes the metal from the exterior surface of the structure and flows through the etch channel to fully etch the metal layers. The metal etch leaves behind a dielectric structure characterizing a photonic device. The photonic device may be a suspended rib waveguide, a suspended channel waveguide, a grating coupler, an interlayer coupler, a photodetector, a phase modulator, an edge coupler, and the like. A photonics system may include one or more of such devices.

Abstract: A method of fabricating a photonic device includes in part, forming a multitude of metal and dielectric layers over a semiconductor substrate to form a structure. The metal layers form a continuous metal trace that characterize an etch channel. At least one of the metal layers extends towards an exterior surface of the structure such that when the structure is exposed to a metal etch, the metal etch removes the metal from the exterior surface of the structure and flows through the etch channel to fully etch the metal layers. The metal etch leaves behind a dielectric structure characterizing a photonic device. The photonic device may be a suspended rib waveguide, a suspended channel waveguide, a grating coupler, an interlayer coupler, a photodetector, a phase modulator, an edge coupler, and the like. A photonics system may include one or more of such devices.