Patents by Inventor Craig F. Lapinski

Craig F. Lapinski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR INTEGRATION OF CIRCUIT COMPONENTS INTO THE BUILD-UP LAYERS OF A PRINTED WIRING BOARD
    Publication number: 20120206890
    Abstract: The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout.
    Type: Application
    Filed: April 25, 2012
    Publication date: August 16, 2012
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Timothy L. Tezak, Craig F. Lapinski, Jay B. Hinerman
  • Manufacturing method of a printed board assembly
    Patent number: 8186042
    Abstract: The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: May 29, 2012
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Timothy L. Tezak, Craig F. Lapinski, Jay B. Hinerman
  • Method for integration of circuit components into the build-up layers of a printed wiring board
    Publication number: 20100282498
    Abstract: The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout.
    Type: Application
    Filed: May 6, 2009
    Publication date: November 11, 2010
    Inventors: Timothy L. Tezak, Craig F. Lapinski, Jay B. Hinerman