Abstract: An unmanned cargo loading and transport system adapted for operation with an unmanned aerial vehicle (UAV) comprising a payload pad comprising a plurality of support members movable from an extended mode to a retracted mode when exposed to a lateral force applied to the support members and a payload container adapted to attach to a UAV and pick up cargo from the payload pad by transferring the weight of the cargo from the payload pad to the payload container. The lower portion of the payload container comprises two generally opposed cargo doors movably mounted at opposed sides and movable inwardly to a closed position and outwardly to an open position to receive cargo when the payload container is positioned at the payload pad. The system further comprises a motive power mechanism coupled to the cargo doors for selectively moving the doors between their open and their closed positions.

Abstract: A process is described for steam reforming a hydrocarbon feedstock, comprising passing a mixture of the hydrocarbon feedstock and steam through a catalyst bed comprising a particulate nickel steam reforming catalyst and a structured nickel steam reforming catalyst disposed within a plurality of externally heated tubes in a tubular steam reformer, wherein each tube has an inlet to which the mixture of hydrocarbon and steam is fed, an outlet from which a reformed gas containing hydrogen, carbon monoxide, carbon dioxide, steam and methane is recovered, and the steam reforming catalyst at the outlet of the tubes is the structured steam reforming catalyst, wherein the particulate steam reforming catalyst comprises 5 to 30% by weight nickel, and the structured steam reforming catalyst comprises nickel dispersed over the surface of a porous metal oxide present as a coating on a non-porous metal or ceramic structure.

Abstract: A Logistics Center for the processing and delivery is described. The Logistics Center and process provide customers with a plurality of delivery and/or retrieval options of a shipped package.

Abstract: A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.

Abstract: Systems and methods for integrating alarm processing and presentation of alarms for a power generation system are described. A template or graphical user interface (GUI) for displaying information associated with alarms may be generated for various types of alarms. Information associated with an alarm may be identified based on certain criteria and stored in a template associated with the alarm for presentation to a user. One or more status messages may be output to a display such a that a user or other person responsible for responding to an alarm may receive a current status associated with an alarm, including that an alarm has been processed and is ready to be acted upon. An alarm may be analyzed, categorized, and escalated based on historical information associated with the alarm, as well as determinations made by a user based on information stored in a template associated with alarm.

Abstract: Systems and methods for integrating alarm processing and presentation of alarms for a power generation system are described. A template or graphical user interface (GUI) for displaying information associated with alarms may be generated for various types of alarms. Information associated with an alarm may be identified based on certain criteria and stored in a template associated with the alarm for presentation to a user. One or more status messages may be output to a display such a that a user or other person responsible for responding to an alarm may receive a current status associated with an alarm, including that an alarm has been processed and is ready to be acted upon. An alarm may be analyzed, categorized, and escalated based on historical information associated with the alarm, as well as determinations made by a user based on information stored in a template associated with alarm.

Abstract: In accordance with the present invention, there is provided a routable substrate that may be used, for example, in relation to the manufacture of Dual and Quad Flat No-Lead (DFN/QFN) style semiconductor packages as a substrate or interposer of such packages. The method of fabricating the substrate effectively removes metal from the saw streets and provides a more stable surface structure for wire bonding. The substrate fabrication method also utilizes existing etching techniques which are implemented in a prescribed sequence to achieve no metal in the saw streets and to completely electrically isolated features. Further, the substrate fabrication method includes a molding step intended to replace pressure sensitive adhesive tapes.

Abstract: A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.

Abstract: A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.

Abstract: A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.

Abstract: An apparatus is disclosed for monitoring usage of multiple electrical devices. The apparatus comprises multiple non-invasive current sensors for sensing current in respective conductors associated with the electrical devices. Such conductors may for example be the electrical power supply leads to the devices. The apparatus further includes multiple analogue to digital conversion functions for digitizing the output from the respective current sensors. A microprocessor is arranged to receive the digitized current sensor and is programmed to create usage data relating to the respective electrical devices. Such usage data may include cumulative elapsed running time. The microprocessor has an associated memory in which the usage data is stored in association with corresponding data identifying the electrical devices. The system further includes an interface through which the usage and identifier data are extractable, to provide usage information for the respective electrical devices.

Abstract: A network diagnostic module may use network configuration data in performing network diagnostic methods. The network diagnostic module may use network configuration data to generate baseline network activity data. The network diagnostic module may use network configuration data to identify network components and aggregate network activity data for the components. The network diagnostic module may use network configuration data to identify sets of network components and to access network activity data for the sets. The network diagnostic module may use network activity data to identify sets of network components and to access network configuration data for the sets.

Abstract: An interposer for use in an external lead or land pattern semiconductor package. The interposer includes an interposer body which is molded from a dielectric material. The interposer body defines opposed top and bottom surfaces, an outer peripheral edge, and an inner peripheral edge. Embedded within the interposer body is a die pad which itself defines opposed top and bottom surfaces and a peripheral edge. The bottom surface of the die pad is exposed in and substantially flush with the bottom surface of the interposer body, with the inner peripheral edge of the interposer body and the top surface of the die pad collectively defining a cavity of the interposer. A plurality of electrically conductive interposer leads are embedded within the top surface of the interposer body and at least partially exposed therein. The interposer body forms a nonconductive barrier between each of the interposer leads and between the interposer leads and the die pad.

Abstract: A networking system may include one or more nodes communicating with each other. The nodes may communicate via one or more links, which a switch or other structure may provide. The networking system may include one or more pools of at least one network diagnostic module. A network diagnostic module may test one or more links and may be configured to rove among a plurality of links. The networking system may include an alarm module.

Abstract: A networking system may include one or more nodes communicating with each other. The nodes may communicate via one or more links, which a switch or other structure may provide. The networking system may include one or more pools of at least one network diagnostic module. A network diagnostic module may test one or more links and may be configured to rove among a plurality of links. The networking system may include an alarm module. The alarm module may configure one or more network diagnostic modules to test a link. Preferably, the alarm module may, at least partially in response to a first network diagnostic module detecting particular conditions on a link, configure one or more other network diagnostic modules to test a link. The alarm module may configure the one or more other network diagnostic modules according to priority.

Abstract: A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Abstract: An apparatus for use with a wafer prober and a probe card comprising a stiffening member having a feature defining a first plane. The stiffening member is mountable atop the central portion of the probe card. A reference member is provided to mount to the wafer prober and has an underside with a feature defining a second plane. When the feature of the stiffening member defining the first plane is urged against the feature of the reference member defining a second plane the probe tips of the probe card are substantially planarized relative to the wafer prober.

Abstract: A networking system is provided. The networking system may include a diagnostic module. The diagnostic module may perform any of a variety of network diagnostic functions. The diagnostic module may include an analysis module, which may receive messages and perform any of a variety of network diagnostic functions using the messages it receives. The diagnostic module may include a logic module, which may receive network messages having a first format or structure, may process the network messages it receives into network messages having a second format or structure, and may send the processed messages to the analysis module. The logic module may receive the network messages from an aggregated link.

Abstract: A networking system is provided. The networking system may include a diagnostic module. The diagnostic module may perform any of a variety of network diagnostic functions. The diagnostic module may include an analysis module, which may receive messages and perform any of a variety of network diagnostic functions using the messages it receives. The diagnostic module may include a logic module, which may receive network messages having a first format or structure, may process the network messages it receives into messages having a second format or structure, and may send the processed messages to the analysis module.

Abstract: A networking system is provided. The networking system may include a diagnostic module. The diagnostic module may perform any of a variety of network diagnostic functions. The diagnostic module may include an analysis module, which may receive messages and perform any of a variety of network diagnostic functions using the messages it receives. The analysis module may receive messages and generate a set of one or more statistics using the received messages. The analysis module may generate a signal configured to trigger a bit sequence capture.