Patents by Inventor Craig Hare

Craig Hare has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for an improved filled via
    Patent number: 8362368
    Abstract: The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: January 29, 2013
    Assignee: Ultrasource, Inc.
    Inventors: Michael Casper, Craig Hare, Adam Cook
  • Method and Apparatus for an Improved Filled Via
    Publication number: 20100270062
    Abstract: The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.
    Type: Application
    Filed: March 23, 2010
    Publication date: October 28, 2010
    Applicant: ULTRASOURCE, INC.
    Inventors: Michael Casper, Craig Hare, Adam Cook