Patents by Inventor Craig Heffner
Craig Heffner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10438867Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.Type: GrantFiled: March 8, 2018Date of Patent: October 8, 2019Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, Harlan Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Publication number: 20190279916Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.Type: ApplicationFiled: March 8, 2018Publication date: September 12, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, HARLAN CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA, KEITH R. KIRKWOOD
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Patent number: 10342151Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: GrantFiled: November 1, 2018Date of Patent: July 2, 2019Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya
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Publication number: 20190082551Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: ApplicationFiled: November 1, 2018Publication date: March 14, 2019Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, H. CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA
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Patent number: 10159161Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: GrantFiled: November 17, 2015Date of Patent: December 18, 2018Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya
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Patent number: 9681533Abstract: An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.Type: GrantFiled: November 17, 2015Date of Patent: June 13, 2017Assignee: Northrop Grumman Systems CorporationInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Publication number: 20170142836Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.Type: ApplicationFiled: November 17, 2015Publication date: May 18, 2017Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Publication number: 20170142820Abstract: An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.Type: ApplicationFiled: November 17, 2015Publication date: May 18, 2017Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, H. CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA, KEITH R. KIRKWOOD
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Publication number: 20170142856Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.Type: ApplicationFiled: November 17, 2015Publication date: May 18, 2017Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATIONInventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, H. CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA
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Patent number: 9648749Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.Type: GrantFiled: November 17, 2015Date of Patent: May 9, 2017Assignee: Northrop Grumman Systems CorporationInventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
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Publication number: 20140100962Abstract: Methods, systems, and computer readable media for advertisement-supported wireless offloading are disclosed. According to one aspect, a system for advertisement-supported wireless offloading includes an offload controller for controlling mobile device offloading, the controller including a network interface for sending and receiving messages in a telecommunications network and a control module for detecting a subscriber offload request, causing an advertisement to be sent to the subscriber's mobile device, determining whether the subscriber did or did not accept the advertisement, and providing a response to the offload request based on whether the subscriber did or did not accept the advertisement.Type: ApplicationFiled: October 10, 2013Publication date: April 10, 2014Applicant: Tekelec, Inc.Inventors: Sundaram Rajagopalan, Ajay Padmakar Deo, Michael Craig Heffner
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Patent number: 7132990Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.Type: GrantFiled: February 18, 2005Date of Patent: November 7, 2006Assignee: Northrop Grumman CorporationInventors: Peter A. Stenger, Fred C. Kuss, Kevin LaCour, Craig Heffner, Robert Sisk, Carl D. Wise, Joseph Paquin, Tujuana Hinton, Andrew Walters, David Krafcsik, Brian T. McMonagle, Steven D. Block, Steven S. Handley
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Patent number: 6975267Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.Type: GrantFiled: February 5, 2003Date of Patent: December 13, 2005Assignee: Northrop Grumman CorporationInventors: Peter A. Stenger, Fred C. Kuss, Kevin LaCour, Craig Heffner, Robert Sisk, Carl D. Wise, Joseph Paquin, Tujuana Hinton, Andrew Walters, David Krafcsik, Brian T. McMonagle, Steven D. Block, Steven S. Handley
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Publication number: 20050146479Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.Type: ApplicationFiled: February 18, 2005Publication date: July 7, 2005Inventors: Peter Stenger, Fred Kuss, Kevin LaCour, Craig Heffner, Robert Sisk, Carl Wise, Joseph Paquin, Tujuana Hinton, Andrew Walters, David Krafcsik, Brian McMonagle, Steven Block, Steven Handley
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Publication number: 20040150554Abstract: A vertically integrated Ka-band active electronically scanned antenna including, among other things, a transitioning RF waveguide relocator panel located behind a radiator faceplate and an array of beam control tiles respectively coupled to one of a plurality of transceiver modules via an RF manifold. Each of the beam control tiles includes a respective plurality of high power transmit/receive (T/R) cells as well as dielectric waveguides, RF stripline and coaxial transmission line elements. The waveguide relocator panel is preferably fabricated by a diffusion bonded copper laminate stack up with dielectric filling. The beam control tiles are preferably fabricated by the use of multiple layers of low temperature co-fired ceramic (LTCC) material laminated together.Type: ApplicationFiled: February 5, 2003Publication date: August 5, 2004Inventors: Peter A. Stenger, Fred C. Kuss, Kevin LaCour, Craig Heffner, Robert Sisk, Carl D. Wise, Joseph Paquin, Tujuana Hinton, Andrew Walters, David Krafcsik, Brian T. McMonagle, Steven D. Block, Steven S. Handley